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Keywords: thin film circuits
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Journal Articles

Evaluation of the Dominant Factor for Electromigration in Sputtered High Purity Al Films

X. Zhao, M. Saka, M. Yamashita, F. Togoh
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021003.
https://doi.org/10.1115/1.4001687
Published Online: June 11, 2010
... in group 1: ( a ) 4 N sample and ( b ) 6 N sample 20 08 2009 14 04 2010 11 06 2010 11 06 2010 aluminium electromigration sputtering thin film circuits EM high purity Al film grain boundary diffusion AFD activation energy Thin films...
View Article titled, Evaluation of the Dominant Factor for Electromigration in Sputtered High Purity Al Films
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Topics: Current density, Diffusion (Physics), Electrodiffusion, Grain boundary diffusion, Grain size, Temperature, Sputtering (Irradiation), Circuits, Damage, Strips
Journal Articles

Viscoelastic Characterization of Low-Dielectric Constant SiLK Films Using Nanoindentation in Combination With Finite Element Modeling

J. M. J. den Toonder, Y. Ramone, A. R. van Dijken, J. G. J. Beijer, G. Q. Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 276–285.
https://doi.org/10.1115/1.1938990
Published Online: August 12, 2004
... film circuits 21 06 2004 12 08 2004 2005 American Society of Mechanical Engineers ...
View Article titled, Viscoelastic Characterization of Low-Dielectric Constant SiLK Films Using Nanoindentation in Combination With Finite Element Modeling
Open the PDF for Viscoelastic Characterization of Low-Dielectric Constant SiLK Films Using Nanoindentation in Combination With Finite Element Modeling in another window
Topics: Creep, Finite element analysis, Modeling, Nanoindentation, Stress, Viscoelasticity, Manganese (Metal), Silicon, Relaxation (Physics), Displacement