...Justin Hollis; Darin J. Sharar; Todd Bandhauer High-temperature silicon carbide (SiC) die are the most critical and expensive component in electric vehicle (EV) power electronics (PE) packages and require both active and passive methods to dissipate heat during transient operation. The use of phase...

... thermal solutions for transient applications focus on providing sufficient continuous cooling to address the peak thermal loads as if operating under steady-state conditions. Such a conservative approach guarantees satisfying the thermal challenge but can result in significant cooling overdesign, thus...

... analysis of an electronic package with multiple TECs shows a strong conductive coupling among active TECs during steady-state operation. Transient operation of TECs is capable of driving cold-side temperatures below steady-state values. Our analysis on TEC arrays using current pulses shows that the effect...

...Banafsheh Barabadi; Yogendra K. Joshi; Satish Kumar; Gamal Refai-Ahmed The quality and reliability of interconnects in microelectronics is a major challenge considering the increasing level of integration and high current densities. This work studied the problem of transient Joule heating...