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1-4 of 4
Keywords: vapour pressure
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031010.
Published Online: July 31, 2009
... reflow electronic package multiscale analysis diffusion integrated circuit packaging moisture numerical analysis vapour pressure 09 01 2008 22 03 2009 31 07 2009 2009 American Society of Mechanical Engineers ...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031011.
Published Online: July 31, 2009
... reflow chip scale package soft film cavitation unstable void growth wafer level film (WLF) cohesive failure die-attach desorption diffusion integrated circuit packaging moisture vapour pressure 18 09 2008 22 03 2009 31 07 2009 2009 American Society of Mechanical...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 460–465.
Published Online: January 21, 2005
... packaging reliability moisture humidity vapour pressure moulding Moisture plays an important role in the reliability of plastic electronic packaging. The presence of moisture in the plastic package induces hygroscopic stress through hygroswelling, induces vapor pressure that is responsible...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 262–267.
Published Online: June 26, 2004
... of the vapor pressure induced expanison on the material’s deformation is discussed. 22 06 2004 26 06 2004 electronics packaging micromechanics deformation encapsulation vapour pressure integrated circuit modelling Polymer materials have wide applications in microelectronic...
