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Keywords: voids
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2013, 135(4): 041003.
Paper No: EP-13-1030
Published Online: September 4, 2013
... of the Laser bar packaging were simulated by finite element analysis (FEA). On the basis of prior experimental observations, voids in the bonding layer were intentionally introduced in the FEA model to examine their effect on the laser diode operating in the continuous-wave (CW) mode under different drive...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011008.
Published Online: February 4, 2008
...Leila Jannesari Ladani; Abhijit Dasgupta This study examines damage initiation and propagation in solder joints with voids, under thermomechanical cyclic loading. An accelerated thermal cycling test is conducted on printed wiring assemblies (PWAs) containing 256 input/output (I/O) plastic ball grid...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 273–277.
Published Online: September 8, 2006
...Leila Jannesari Ladani; Abhijit Dasgupta The effect of process-induced voids on the durability of Sn–Pb and Pb-free solder interconnects in electronic products is not clearly understood. Experimental studies have provided conflicting ambiguous conclusions, showing that voids may sometimes...