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Keywords: voids (solid)
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011002.
Published Online: March 4, 2010
... generation through the numerical example of a standard wafer electromigration accelerated test (SWEAT) structure with the measurement result is discussed. 22 08 2008 27 09 2009 04 03 2010 04 03 2010 electromigration failure analysis voids (solid) In semiconductor devices...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011014.
Published Online: February 18, 2009
... microscopy shear strength silver alloys solders tin alloys voids (solid) X-ray chemical analysis 29 04 2007 19 02 2008 18 02 2009 2009 American Society of Mechanical Engineers ...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031008.
Published Online: August 1, 2008
... tin alloys voids (solid) electromigration Sn-3.0Ag-0.5Cu current crowding interfacial reaction finite element analysis To meet the higher performance and miniaturization requirements for advanced electronic products such as microprocessors, the number of input∕output ports...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011008.
Published Online: February 4, 2008
... fatigue finite element analysis flaw detection solders thermomechanical treatment voids (solid) Pb-free solder voids thermo-mechanical durability simulation energy partitioning successive initiation damage initiation damage propagation Voids originating during the manufacturing...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 273–277.
Published Online: September 8, 2006
... finite element analysis reliability solders voids (solid) FEA voids lead-free thermomechanical durability Voids are one of the major categories of manufacturing defects in solder joints of electronic assemblies that can potentially degrade the reliability of interconnects. Voids can...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 202–207.
Published Online: November 24, 2005
...-chip devices assembling solders voids (solid) eutectic alloys copper alloys tin alloys lead alloys silver alloys Solder alloy are commonly used for bonding computer chips to carriers and packages. The reliability of solder joints has become more critical, as electronic components...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 192–201.
Published Online: November 23, 2005
... metallisation materials testing shear deformation nucleation ductile fracture mechanical testing voids (solid) gold copper aluminium fractography shear fracture gold ball bond copper ball bond thermosonic bonding interface In integrated circuit (IC) chip manufacturing, wire bonding...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 440–445.
Published Online: January 4, 2005
... 04 01 2005 solders cooling flip-chip devices melting microassembling directional solidification integrated circuit packaging voids (solid) lead alloys tin alloys silver alloys reflow soldering In a flip chip assembly, the solder joints connecting the chip and its circuit...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 120–126.
Published Online: May 18, 2004
... solders flip-chip devices integrated circuit reliability microassembling integrated circuit packaging reflow soldering voids (solid) Flip-chip technology has been positioned as a key electronic packaging technology to meet the requirement of low-cost, lightweight, small size, and high...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 392–399.
Published Online: September 17, 2003
... 2002 17 09 2003 microassembling packaging failure analysis delamination finite element analysis stress analysis adhesion voids (solid) An advanced chip stack technology has been developed in recent years due to drive of the consumer electronic market. Stacking of chips can...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 329–334.
Published Online: September 17, 2003
... 2003 bubbles reflow soldering voids (solid) surface tension viscosity flip-chip devices microassembling integrated circuit packaging The reliability of solder bumps has become more critical as the components become smaller. Figure 1 shows a typical flip-chip assembly commonly...
Journal Articles
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. June 2003, 125(2): 302–307.
Published Online: June 10, 2003
... February 2001 08 April 2002 10 06 2003 encapsulation flip-chip devices microwave heating polymers curing delamination voids (solid) This paper discusses a new method for rapid curing of encapsulants such as underfills in flip-chips using variable frequency microwaves (VFM...
Journal Articles
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 292–297.
Published Online: July 26, 2002
... alloys soldering creep slip nucleation voids (solid) fatigue thermal stresses stress analysis viscoplasticity stress relaxation Eutectic Pb-Sn solder used in electronic packaging applications is known to be highly viscoplastic in use environments because of the high homologous...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 220–226.
Published Online: November 5, 1999
... composite material interfaces fatigue cracks voids (solid) fracture mechanics dislocation arrays Advanced microelectronic materials exhibit time-dependent degradation and failure under creep or cyclic loading conditions. For example, cracks may nucleate in microelectronic packages during thermal...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 192–199.
Published Online: August 30, 1999
... integrated circuit packaging integrated circuit interconnections stress analysis inclusions voids (solid) internal stresses thermal stresses thermal stress cracking failure analysis Voiding and fracture of critical components in electronic packaging, such as passivated metallic lines...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 172–177.
Published Online: May 21, 1999
... . ceramic capacitors ceramic packaging delamination reliability failure analysis acoustic microscopy ultrasonic materials testing flaw detection thermal stress cracking voids (solid) acoustic tomography Ceramic substrates play an extremely important role in electronic packages. Low...