An experimental investigation is carried out to study heat transfer in the entrance region of an array of rectangular heated blocks. The focus of the work is on the entrance heat transfer coefficients and the associated thermal wake effects. The experiments were performed with air as the working fluid. The geometric parameters of the array were varied in the range identified with B/L = 0.5, S/L = 0.128–0.33, and H/L = 0.128–1. The Reynolds number, based on the height above the blocks and the fluid mean velocity in the bypass channel, ranged from 3000 to 15,000. The adiabatic heat transfer coefficients and thermal wake effects are correlated for the entrance region. These correlations are incorporated into a user-friendly FORTRAN program, which can be used by the engineers to predict the working temperatures of the components of circuit boards with similar layout. A typical computer output indicated that the mean deviation between the measured and predicted temperatures is 11.0 percent.
Skip Nav Destination
Article navigation
Research Papers
A Correlation for Heat Transfer and Wake Effect in the Entrance Region of an In-Line Array of Rectangular Blocks Simulating Electronic Components
M. Molki,
M. Molki
Department of Mechanical Engineering, Esfahan University of Technology, Esfahan, Iran
Search for other works by this author on:
M. Faghri,
M. Faghri
Department of Mechanical Engineering and Applied Mechanics, University of Rhode Island, Kingston, RI 02881
Search for other works by this author on:
O. Ozbay
O. Ozbay
Department of Mechanical Engineering and Applied Mechanics, University of Rhode Island, Kingston, RI 02881
Search for other works by this author on:
M. Molki
Department of Mechanical Engineering, Esfahan University of Technology, Esfahan, Iran
M. Faghri
Department of Mechanical Engineering and Applied Mechanics, University of Rhode Island, Kingston, RI 02881
O. Ozbay
Department of Mechanical Engineering and Applied Mechanics, University of Rhode Island, Kingston, RI 02881
J. Heat Transfer. Feb 1995, 117(1): 40-46 (7 pages)
Published Online: February 1, 1995
Article history
Received:
July 1, 1993
Revised:
April 1, 1994
Online:
December 5, 2007
Citation
Molki, M., Faghri, M., and Ozbay, O. (February 1, 1995). "A Correlation for Heat Transfer and Wake Effect in the Entrance Region of an In-Line Array of Rectangular Blocks Simulating Electronic Components." ASME. J. Heat Transfer. February 1995; 117(1): 40–46. https://doi.org/10.1115/1.2822320
Download citation file:
Get Email Alerts
Cited By
Related Articles
Direct Air Cooling of Electronic Components: Reducing Component Temperatures by Controlled Thermal Mixing
J. Heat Transfer (February,1991)
Confined and Submerged Liquid Jet Impingement Heat Transfer
J. Heat Transfer (November,1995)
Heat Transfer Measurement and Analysis for Sintered Porous Channels
J. Heat Transfer (May,1994)
Applying Heat Transfer Coefficient Data to Electronics Cooling
J. Heat Transfer (November,1990)
Related Proceedings Papers
Related Chapters
Thermal Design Guide of Liquid Cooled Systems
Thermal Design of Liquid Cooled Microelectronic Equipment
Radiation
Thermal Management of Microelectronic Equipment
Liquid Cooled Systems
Thermal Management of Telecommunication Equipment, Second Edition