This paper presents the numerical predictions of heat transfer and fluid flow characteristics for natural convection in a vertical channel with two-dimensional protruding heat-flux module as applied to the cooling of electronic components. The investigation is for a configuration consisting of a single module mounted on a vertical adiabatic wall. An attempt was made to combine the temperature of the module for all the dimensions of the module into a single composite correlation, along with the numerical data.
Issue Section:
Technical Notes
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