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Journal Articles

Experimental Study of Process Emissions From Atomic Layer Deposition of Al 2 O 3 Under Various Temperatures and Purge Time

Lulu Ma, Dongqing Pan, Yuanyuan Xie, Fenfen Wang, Chris Yuan
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research-Article
J. Manuf. Sci. Eng. May 2017, 139(5): 051013.
Paper No: MANU-16-1407
https://doi.org/10.1115/1.4035722
Published Online: January 30, 2017
View Article titled, Experimental Study of Process Emissions From Atomic Layer Deposition of Al 2 O 3 Under Various Temperatures and Purge Time
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Topics: Emissions, Nanoparticles, Temperature, Methane, Cycles
Journal Articles

Atomic Layer Deposition Process Modeling and Experimental Investigation for Sustainable Manufacturing of Nano Thin Films

Dongqing Pan, Dongsheng Guan, Tien-Chien Jen, Chris Yuan
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research-Article
J. Manuf. Sci. Eng. October 2016, 138(10): 101010.
Paper No: MANU-16-1019
https://doi.org/10.1115/1.4034475
Published Online: September 13, 2016
View Article titled, Atomic Layer Deposition Process Modeling and Experimental Investigation for Sustainable Manufacturing of Nano Thin Films
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Topics: Cycles, Emissions, Gas flow, Manufacturing, Methane, Modeling, Sustainability, Temperature, Thin films, Water
Journal Articles

Integrated Sustainability Analysis of Atomic Layer Deposition for Microelectronics Manufacturing

Chris Y. Yuan, David A. Dornfeld
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Special Issue On Nanomanufacturing
J. Manuf. Sci. Eng. June 2010, 132(3): 030918.
https://doi.org/10.1115/1.4001686
Published Online: June 14, 2010
View Article titled, Integrated Sustainability Analysis of Atomic Layer Deposition for Microelectronics Manufacturing
Open the PDF for Integrated Sustainability Analysis of Atomic Layer Deposition for Microelectronics Manufacturing in another window
Topics: Cycles, Emissions, Energy consumption, Flow (Dynamics), Manufacturing, Microelectronic devices, Semiconductor wafers, Sustainability, Thin films, Water