... machining (FAM) process are studied using a single-sided wafer-lapping machine. Under the same slurry density, a parametric experimental study employing different mixing ratios of large and small abrasive grits and various normal loadings on the wafer surface applied through a jig is conducted. Observations...

.../0043-1648(88)90236-0 08 08 2009 03 03 2011 25 03 2011 25 03 2011 abrasives brittle fracture diamond ductile-brittle transition lapping (machining) optical fibres lapping process of optical fiber material removal mechanisms material removal mode brittle...

... model is better than the widely used universal Kriging model with a mean of second order polynomial functions. cutting Galerkin method Gaussian processes lapping (machining) manufacturing processes partial differential equations random noise sawing machines wire saw slicing wafer...

... surfaces on titanium articles using the pack boriding technique, it appears that the substrate raw materials should be free of residual stresses and consist of a fine microstructure. 13 05 2008 22 12 2008 15 04 2009 annealing internal stresses lapping (machining) prosthetics...

... to obtain fiber connectors with 90% overall yield using two-step process. 16 10 2006 17 02 2008 03 06 2008 grinding lapping (machining) optical interconnections Surging demand for a wide variety of data and telecommunication services that use interconnection components...

... magnetorheological finishing deformed surface layer subsurface damage magnetic materials magnetorheology intelligent materials magnetic materials surface finishing grinding lapping (machining) surface roughness tungsten compounds cobalt 30 10 2006 09 03 2007 2007 American...

...Masahiro Mizuno; Toshirou Iyama; Susumu Sugawara; Bi Zhang A prototype lapping machine, which finishes surfaces by applying elliptical motions to a lapping tool in the presence of diamond compound, is developed. This paper describes the structure of the lapping machine, the 2-dimensional tool...