Search Results | J. Eng. Mater. Technol.

1-20 of 87

2 3 4 5

Sort by

Sort Order Select

Journal Articles

A Multiscale Simulation Approach for the Mechanical Response of Copper/Nickel Nanofoams With Experimental Validation

Hang Ke, Alexandra Loaiza, Andres G. Jimenez, David F. Bahr, Ioannis Mastorakos

J. Eng. Mater. Technol. January 2022, 144(1): 011011.

Paper No: MATS-21-1066

DOI: https://doi.org/10.1115/1.4051806

Published Online: August 3, 2021

View Article

Topics: Alloys, Compression, Copper, Density, Mechanical behavior, Nickel, Simulation, Stress-strain curves, Atoms, Plasticity

Journal Articles

Modeling of Tertiary Creep in Copper at 215 and 250 °C

Rolf Sandström, Fangfei Sui

J. Eng. Mater. Technol. July 2021, 143(3): 031001.

Paper No: MATS-20-1257

DOI: https://doi.org/10.1115/1.4049241

Published Online: January 13, 2021

View Article

Topics: Copper, Creep, Dislocations, Necking, Cavitation

Journal Articles

Effect of Ni and Zn Elements on the Microstructure and Antibacterial Properties of Cu Coatings

Khaled S. Al-Athel, Najat Marraiki, Abul Fazal M. Arif, Syed Sohail Akhtar, Javad Mostaghimi, Mohamed Ibrahim

J. Eng. Mater. Technol. January 2020, 142(1): 011004.

Paper No: MATS-18-1322

DOI: https://doi.org/10.1115/1.4044265

Published Online: August 1, 2019

View Article

Topics: Coatings, Coating processes, Copper, Surface roughness

Journal Articles

Use of Polymer Scaffolding and Electroplating to Create Porous Metal Structures

Adam Mihalko, Jordan Felice, Allen Madura, Davide Piovesan

J. Eng. Mater. Technol. July 2019, 141(3): 034501.

Paper No: MATS-17-1045

DOI: https://doi.org/10.1115/1.4042660

Published Online: March 11, 2019

View Article

Topics: Copper, Electroplating, Metals, Polymers, Porous materials, Porosity, Additive manufacturing, Electroforming, Scanning electron microscopes, Metalwork

Journal Articles

A Constitutive Model Fitting Methodology for Ductile Metals Using Cold Upsetting Tests and Numeric Optimization Techniques

Devon C. Hartlen, Darrel A. Doman

J. Eng. Mater. Technol. January 2019, 141(1): 011008.

Paper No: MATS-18-1098

DOI: https://doi.org/10.1115/1.4040592

Published Online: July 18, 2018

View Article

Topics: Aluminum, Brass (Metal), Constitutive equations, Copper, Finite element model, Fittings, Hardening, Metals, Optimization, Plasticity

Journal Articles

Quantum Conductance of Copper–Carbon Nanotube Composites

Yangchuan Li, Eric Fahrenthold

J. Eng. Mater. Technol. July 2018, 140(3): 031007.

Paper No: MATS-17-1257

DOI: https://doi.org/10.1115/1.4039293

Published Online: April 6, 2018

View Article

Topics: Carbon nanotubes, Composite materials, Copper, Electrical conductance, Junctions, Electrical conductivity

Journal Articles

First-Principles Investigation of Intergranular Fracture in Copper by Grain Boundary Segregation of Sulfur

Xudong Wang, Lahouari Benabou

J. Eng. Mater. Technol. January 2018, 140(1): 011008.

Paper No: MATS-17-1064

DOI: https://doi.org/10.1115/1.4037274

Published Online: August 9, 2017

View Article

Topics: Atoms, Copper, Fracture (Materials), Fracture (Process), Grain boundaries, Sulfur

Journal Articles

Tensile Yield Strength of a Material Preprocessed by Simple Shear

Cai Chen, Yan Beygelzimer, Laszlo S. Toth, Yuri Estrin, Roman Kulagin

J. Eng. Mater. Technol. July 2016, 138(3): 031010.

Paper No: MATS-15-1281

DOI: https://doi.org/10.1115/1.4033071

Published Online: May 10, 2016

View Article

Topics: Shear (Mechanics), Stress, Tension, Torsion, Yield strength, Flow (Dynamics), Residual stresses, Copper, Deformation, Strain gradient

Journal Articles

Comparison of Static and Dynamic Powder Compaction: Experiment and Simulation

C. A. Braun, M. Schumaker, J. Rice, J. P. Borg

J. Eng. Mater. Technol. January 2016, 138(1): 011003.

Paper No: MATS-15-1031

DOI: https://doi.org/10.1115/1.4031615

Published Online: October 8, 2015

View Article

Topics: Compacting, Copper, Density, Engineering simulation, Simulation, Stress, Temperature, Pressure, Particulate matter, Shock (Mechanics)

Journal Articles

Static Recovery Activation Energy of Pure Aluminum at Room Temperature

Yeh An-Chou, Chuang Ho-Chieh, Kuo Chen-Ming

J. Eng. Mater. Technol. July 2014, 136(3): 034501.

Paper No: MATS-13-1172

DOI: https://doi.org/10.1115/1.4026938

Published Online: March 25, 2014

View Article

Topics: Aluminum, Dislocations, Temperature, Copper

Journal Articles

Statistical Characteristics of Fatigue Failure of Copper Thin Films

Jae-Won Jang, Yun Hwangbo, Jae-Hyun Kim, Hak-Joo Lee, Alexander E. Mag-isa, Soon-Bok Lee

J. Eng. Mater. Technol. October 2013, 135(4): 041007.

Paper No: MATS-13-1074

DOI: https://doi.org/10.1115/1.4025319

Published Online: September 17, 2013

View Article

Topics: Copper, Fatigue, Fatigue failure, Fatigue life, Fatigue testing, Statistical analysis, Statistical distributions, Stress, Thin films

Journal Articles

Effect of Addition of Nano-Al 2 O 3 and Copper Particulates and Heat Treatment on the Tensile Response of AZ61 Magnesium Alloy

Q. B. Nguyen, Y. H. D. Chua, K. S. Tun, J. Chan, R. Kwok, W. L. E. Wong, M. Gupta

J. Eng. Mater. Technol. July 2013, 135(3): 031004.

Paper No: MATS-12-1003

DOI: https://doi.org/10.1115/1.4023769

Published Online: May 6, 2013

View Article

Topics: Composite materials, Copper, Fracture (Materials), Fracture (Process), Heat treating (Metalworking), Magnesium alloys, Particulate matter, Thermal expansion, Magnesium (Metal), Density

Journal Articles

Direct Observation of Crack Propagation in Copper–Niobium Multilayers

K. Hattar, A. Misra, M. R. F. Dosanjh, P. Dickerson, I. M. Robertson, R. G. Hoagland

J. Eng. Mater. Technol. April 2012, 134(2): 021014.

DOI: https://doi.org/10.1115/1.4005953

Published Online: March 27, 2012

View Article

Topics: Copper, Crack propagation, Deformation, Failure, Fracture (Materials), Necking, Dislocations, Grain boundaries

Journal Articles

Texture and Grain Boundary Character Distribution in a Thermomechanically Processed OFHC Copper

Khaled J. Al-Fadhalah

J. Eng. Mater. Technol. January 2012, 134(1): 011001.

DOI: https://doi.org/10.1115/1.4004069

Published Online: December 6, 2011

View Article

Topics: Annealing, Copper, Electron backscatter diffraction, Grain boundaries, Recrystallization, Texture (Materials), Twinning, Brass (Metal), Cold rolling, Thermomechanical treatment

Journal Articles

Study of Machining-Induced Microstructure Variations of Nanostructured/Ultrafine-Grained Copper Using XRD

Yong Huang, Mason Morehead

J. Eng. Mater. Technol. April 2011, 133(2): 021007.

DOI: https://doi.org/10.1115/1.4003105

Published Online: March 4, 2011

View Article

Topics: Copper, Dislocation density, Grain size, Machining, Dislocations

Journal Articles

Creep Behavior of Copper and Cu–0.3Cr–0.1Ag Alloy

A. Akbari-Fakhrabadi, R. Mahmudi, A. Karsaz, A. R. Geranmayeh

J. Eng. Mater. Technol. October 2010, 132(4): 044501.

DOI: https://doi.org/10.1115/1.4002356

Published Online: September 29, 2010

View Article

Topics: Alloys, Copper, Creep, Stress, Temperature, Dislocations

Journal Articles

Quantitative Interfacial Energy Measurements of Adhesion-Promoted Thin Copper Films by Supercritical Fluid Deposition on Barrier Layers

Christos F. Karanikas, Han Li, Joost J. Vlassak, James J. Watkins

J. Eng. Mater. Technol. April 2010, 132(2): 021014.

DOI: https://doi.org/10.1115/1.4000283

Published Online: February 22, 2010

View Article

Topics: Adhesion, Copper, Fracture mechanics, Supercritical fluids

Journal Articles

A Phenomenological Constitutive Equation to Describe Various Flow Stress Behaviors of Materials in Wide Strain Rate and Temperature Regimes

Hyunho Shin, Jong-Bong Kim

J. Eng. Mater. Technol. April 2010, 132(2): 021009.

DOI: https://doi.org/10.1115/1.4000225

Published Online: February 18, 2010

View Article

Topics: Constitutive equations, Copper, Deformation, Flow (Dynamics), Stress, Temperature, Work hardening, Tantalum, Melting

Journal Articles

The Wavelike Plastic Deformation of Single Crystal Copper

Russell J. McDonald, Christos Efstathiou, Peter Kurath

J. Eng. Mater. Technol. July 2009, 131(3): 031013.

DOI: https://doi.org/10.1115/1.3120410

Published Online: June 4, 2009

View Article

Topics: Copper, Crystals, Deformation, Waves

Journal Articles

Mesoscopic Investigation of the Heterogeneities Induced by Channel-Die Compression

Michel G. Darrieulat, Khalid Zhani, René-Yves Fillit, Ahmed Chenaoui

J. Eng. Mater. Technol. July 2009, 131(3): 031005.

DOI: https://doi.org/10.1115/1.3120390

Published Online: May 22, 2009

View Article

Topics: Compression, Deformation, Mesoscopic systems, X-rays, Carbon, Metals, Copper

2 3 4 5

Journal citation

NARROW

A Multiscale Simulation Approach for the Mechanical Response of Copper/Nickel Nanofoams With Experimental Validation

Modeling of Tertiary Creep in Copper at 215 and 250 °C

Effect of Ni and Zn Elements on the Microstructure and Antibacterial Properties of Cu Coatings

Use of Polymer Scaffolding and Electroplating to Create Porous Metal Structures

A Constitutive Model Fitting Methodology for Ductile Metals Using Cold Upsetting Tests and Numeric Optimization Techniques

Quantum Conductance of Copper–Carbon Nanotube Composites

First-Principles Investigation of Intergranular Fracture in Copper by Grain Boundary Segregation of Sulfur

Tensile Yield Strength of a Material Preprocessed by Simple Shear

Comparison of Static and Dynamic Powder Compaction: Experiment and Simulation

Static Recovery Activation Energy of Pure Aluminum at Room Temperature

Statistical Characteristics of Fatigue Failure of Copper Thin Films

Effect of Addition of Nano-Al 2 O 3 and Copper Particulates and Heat Treatment on the Tensile Response of AZ61 Magnesium Alloy

Direct Observation of Crack Propagation in Copper–Niobium Multilayers

Texture and Grain Boundary Character Distribution in a Thermomechanically Processed OFHC Copper

Study of Machining-Induced Microstructure Variations of Nanostructured/Ultrafine-Grained Copper Using XRD

Creep Behavior of Copper and Cu–0.3Cr–0.1Ag Alloy

Quantitative Interfacial Energy Measurements of Adhesion-Promoted Thin Copper Films by Supercritical Fluid Deposition on Barrier Layers

A Phenomenological Constitutive Equation to Describe Various Flow Stress Behaviors of Materials in Wide Strain Rate and Temperature Regimes

The Wavelike Plastic Deformation of Single Crystal Copper

Mesoscopic Investigation of the Heterogeneities Induced by Channel-Die Compression

Journals

Conference Proceedings

eBooks

Resources

Opportunities

Journals

Conference Proceedings

eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only