..., recently been developed. These models were used to predict tertiary creep for copper at 75 °C. In the present paper, these models are applied to creep tests at higher temperatures (215 and 250 °C). These results demonstrate again that tertiary creep in copper is primarily controlled accelerated recovery...

... here. 26 07 2011 12 09 2011 08 12 2011 08 12 2011 copper dislocation energy dislocation interactions elasticity solid-state phase transformations stacking faults yield strength Dislocation-particle interactions affect mechanical properties of crystalline...

...Khaled J. Al-Fadhalah The effect of texture on grain boundary character distribution (GBCD) in thermomechanically processed oxygen-free high-conductivity copper has been investigated. Copper samples were cold rolled to a reduction in thickness of 50% and then annealed for 60 min in the range of 400...

...Yong Huang; Mason Morehead Various methods for the production of bulk nanostructured (NS)/ultrafine-grained (UFG) materials have been developed, including equal channel angular extrusion (ECAE), a form of severe plastic deformation. Using an ECAE NS/UFG copper bar as an example, this study has...

...A. Akbari-Fakhrabadi; R. Mahmudi; A. Karsaz; A. R. Geranmayeh The creep behavior of Cu–0.3Cr–0.1Ag alloy was investigated by the impression creep testing technique and compared with that of pure copper under constant punching stress in the range 80–550 MPa at temperatures in the range 688–855 K...

...Christos F. Karanikas; Han Li; Joost J. Vlassak; James J. Watkins A fivefold increase in adhesion energy is observed for poly(acrylic acid) (PAA) modified Cu/TaN interfaces in which the thin copper films are deposited by the hydrogen assisted reduction of bis(2,2,7-trimethyloctane-3,5-dionato...

... are the material parameters. The proposed model successfully describes not only the linear rise of flow stress with logarithmic strain rate for many metals, but also the upturn of the flow stress at strain rate over about 10 4 s − 1 for the case of copper. It can also describe the exponential increase in the flow...

... ( 210 ) ⟨ 001 ⟩ interface. Translations parallel and perpendicular to the interface plane result in a periodic repeating structure at the interface. 02 02 2009 03 04 2009 27 08 2009 bicrystals copper crystal microstructure dislocations grain boundaries...

...Russell J. McDonald; Christos Efstathiou; Peter Kurath The purpose of this work is to explore nonuniform plastic flow at small length- and time-scales. Pure single crystal copper tensile specimens were pulled along the [ 6 ¯ 5 6 ] crystal axis at three nominal strain-rates: 0.01%/s, 0.04%/s...

... on the device can be found on the manufacturer’s website ( 20 ). When fitted on a conventional equipment, the mounting and dismounting of the spare parts specific to mesoscopic measurements (source, detector, etc.) take less than 1 h. Since aluminum was investigated, copper was used as the anode material...

... on sheared and on extruded samples confirms that the extrusion promotes massively simple shear. Besides, the grain refinement is measured with a dedicated transmission electron microscopy (TEM) attachment. It is shown that the grain size decreases regularly for a low carbon steel as well as for copper, down...

... elastic strain energy density is also examined. The effects of applying stress bound constraints on the SPF inversion are discussed, as are extensions of QSA to examine defect nucleation and propagation. 08 08 2007 23 01 2008 28 03 2008 copper crystal defects crystal...

.... A finite element is also run and compared with the two models proposed in this work. Results from both models are compared with available experimental results for oxygen-free high-conductivity copper and 1018 cold rolled steel, and both models show reasonably good agreement with the experimental results...

...Sathyan Subbiah; Shreyes N. Melkote Orthogonal cutting experiments using a quick-stop device are performed on Al2024-T3 and OFHC copper to study the chip–workpiece interface in a scanning electron microscope. Evidence of ductile tearing ahead of the tool at cutting speeds of 150 m ∕ min has been...

...Y. V. R. K. Prasad; K. P. Rao Processing map for the hot deformation of high purity oxygen free high conductivity (OFHC) copper ( 2 ppm oxygen) has been developed in the temperature range 600 - 950 ° C and strain rate range 0.001 - 100 s − 1 . The map is compared with those published earlier...

.... The bimetal test specimen is prepared by melting and casting solder in a Pyrex tube ( 10 ). The tip of one of the copper ends (see details of bimetal test specimen in Fig. 1 ) is dipped in a wetting material (soldering paste). Then a closely fitted Pyrex tube is inserted over the copper end. Solder in small...

...Agnieszka M. Wusatowska-Sarnek Initial stage of dynamic recrystallization (DRX) under warm and hot deformation was investigated in polycrystalline copper. At the onset of DRX at intermediate deformation temperatures (i.e., high values of Zener–Hollomon parameter Z ) large orientation gradients...

... to a novel shape memory effect to Cu nanowires not seen in bulk Cu. 02 01 2005 07 03 2005 copper nanowires elasticity molecular dynamics method crystal orientation twin boundaries martensitic transformations elongation shape memory effects Nanocomponents are of great...

...Yong Gan; Dongyun Lee; Xi Chen; Jeffrey W. Kysar Nanocomposite thin films which consist of 50 nm Al 2 O 3 nanoparticles in a copper metal matrix were deposited on a silicon wafer. The thickness of the nanocomposite thin films was about 3 microns and the volume density of the nanoparticles...

.... , and Lu , K. , 1999 , “ Interface Controlled Diffusional Creep of Nanocrystalline Pure Copper ,” Scr. Mater. 1359-6462 10.1016/S1359-6462(99)00213-4 , 41 , pp...