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Alexander Otto
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Journal Articles

Investigation of Active Power Cycling Combined With Passive Thermal Cycles on Discrete Power Electronic Devices

Alexander Otto, Sven Rzepka, Bernhard Wunderle
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031012.
Paper No: EP-18-1098
https://doi.org/10.1115/1.4043646
Published Online: June 17, 2019
View Articletitled, Investigation of Active Power Cycling Combined With Passive Thermal Cycles on Discrete Power Electronic Devices
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Topics: Cycles, Failure, Junctions, Temperature, Wire, Stress, Failure mechanisms, Thermomechanics
Proceedings Papers

Investigation of Active Power Cycling Combined With Passive Thermal Cycles on Discrete Power Electronic Devices for Automotive Applications

Alexander Otto, Sven Rzepka, Bernhard Wunderle
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A003, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8348
https://doi.org/10.1115/IPACK2018-8348
View Paper titled, Investigation of Active Power Cycling Combined With Passive Thermal Cycles on Discrete Power Electronic Devices for Automotive Applications
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Topics: Automotive industry, Cycles, Electronics, Stress, Reliability, Heating, Testing, Failure, Failure mechanisms, Junctions
Journal Articles

Application-Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches

Sven Rzepka, Alexander Otto, Dietmar Vogel, Rainer Dudek
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010903.
Paper No: EP-17-1090
https://doi.org/10.1115/1.4039333
Published Online: March 2, 2018
View Articletitled, Application-Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches
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Topics: Electronics, Failure, Reliability, Stress, Temperature, Failure mechanisms, Cycles, Safety, Failure analysis, Simulation
Proceedings Papers

Application Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches

Sven Rzepka, Alexander Otto, Dietmar Vogel, Rainer Dudek
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A008, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74208
https://doi.org/10.1115/IPACK2017-74208
View Paper titled, Application Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches
Open the PDF for Application Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches in another window
Topics: Electronics, Reliability, Safety, Automotive industry, Failure, Vehicles, Actuators, Computation, Design, Electric vehicles