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Craig Green
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Journal Articles

A Review of Two-Phase Forced Cooling in Three-Dimensional Stacked Electronics: Technology Integration

Craig Green, Peter Kottke, Xuefei Han, Casey Woodrum, Thomas Sarvey, Pouya Asrar, Xuchen Zhang, Yogendra Joshi, Andrei Fedorov, Suresh Sitaraman, Muhannad Bakir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2015, 137(4): 040802.
Paper No: EP-15-1068
https://doi.org/10.1115/1.4031481
Published Online: September 25, 2015
View Articletitled, A Review of Two-Phase Forced Cooling in Three-Dimensional Stacked Electronics: Technology Integration
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Topics: Coolants, Cooling, Design, Flow (Dynamics), Fluids, Heat sinks, Heat, Flux (Metallurgy), Temperature, Pressure
Journal Articles

Fluid-to-Fluid Spot-to-Spreader (F2/S2) Hybrid Heat Sink for Integrated Chip-Level and Hot Spot-Level Thermal Management

Craig Green, Andrei G. Fedorov, Yogendra K. Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Design Innovations
J. Electron. Packag. June 2009, 131(2): 025002.
https://doi.org/10.1115/1.3104029
Published Online: April 3, 2009
View Articletitled, Fluid-to-Fluid Spot-to-Spreader (F2/S2) Hybrid Heat Sink for Integrated Chip-Level and Hot Spot-Level Thermal Management
Open the PDF for Fluid-to-Fluid Spot-to-Spreader (F2/S2) Hybrid Heat Sink for Integrated Chip-Level and Hot Spot-Level Thermal Management in another window
Topics: Coolants, Cooling, Design, Fluids, Heat, Heat sinks, Flow (Dynamics), Heat flux, Stress, Flux (Metallurgy)