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David Gonzalez Cuadrado
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Journal Articles

Sensitivity Coefficient-Based Inverse Heat Conduction Method for Identifying Hot Spots in Electronics Packages: A Comparison of Grid-Refinement Methods

Patrick Krane, David Gonzalez Cuadrado, Francisco Lozano, Guillermo Paniagua, Amy Marconnet
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011008.
Paper No: EP-20-1121
https://doi.org/10.1115/1.4050200
Published Online: August 6, 2021
View Articletitled, Sensitivity Coefficient-Based Inverse Heat Conduction Method for Identifying Hot Spots in Electronics Packages: A Comparison of Grid-Refinement Methods
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Topics: Electronic packages, Heat, Temperature, Errors, Heat conduction
Journal Articles

Experimental Demonstration of Inverse Heat Transfer Methodologies for Turbine Applications

David Gonzalez Cuadrado, Francisco Lozano, Guillermo Paniagua
Journal: Journal of Turbomachinery
Publisher: ASME
Article Type: Research Papers
J. Turbomach. June 2020, 142(6): 061009.
Paper No: TURBO-20-1004
https://doi.org/10.1115/1.4046546
Published Online: May 28, 2020
View Articletitled, Experimental Demonstration of Inverse Heat Transfer Methodologies for Turbine Applications
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Topics: Heat flux, Heat transfer, Temperature, Turbines, Uncertainty, Flow (Dynamics)
Journal Articles

Engine-Scalable Rotor Casing Convective Heat Flux Evaluation Using Inverse Heat Transfer Methods

David Gonzalez Cuadrado, Francisco Lozano, Valeria Andreoli, Guillermo Paniagua
Journal: Journal of Engineering for Gas Turbines and Power
Publisher: ASME
Article Type: Research-Article
J. Eng. Gas Turbines Power. January 2019, 141(1): 011012.
Paper No: GTP-18-1323
https://doi.org/10.1115/1.4040713
Published Online: September 14, 2018
View Articletitled, Engine-Scalable Rotor Casing Convective Heat Flux Evaluation Using Inverse Heat Transfer Methods
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Topics: Engines, Heat flux, Heat transfer, Temperature, Rotors, Pressure, Turbines
Journal Articles

Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips

David Gonzalez Cuadrado, Amy Marconnet, Guillermo Paniagua
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010905.
Paper No: EP-17-1099
https://doi.org/10.1115/1.4039026
Published Online: March 2, 2018
View Articletitled, Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips
Open the PDF for Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips in another window
Topics: Heat conduction, Heat flux, Heat transfer, Integrated circuits, Interpolation, Optimization, Sensors, Temperature, Temperature sensors, Genetic algorithms