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F. J. Hong
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Proceedings Papers

Confined Jet Array Impingement Cooling Using NEPCM Nanofluids

F. J. Hong, C. Y. Zhang, D. H. Chen, G. Chen
Proc. ASME. MNHMT2016, Volume 1: Micro/Nanofluidics and Lab-on-a-Chip; Nanofluids; Micro/Nanoscale Interfacial Transport Phenomena; Micro/Nanoscale Boiling and Condensation Heat Transfer; Micro/Nanoscale Thermal Radiation; Micro/Nanoscale Energy Devices and Systems, V001T02A009, January 4–6, 2016
Publisher: American Society of Mechanical Engineers
Paper No: MNHMT2016-6531
https://doi.org/10.1115/MNHMT2016-6531
View Paper titled, Confined Jet Array Impingement Cooling Using NEPCM Nanofluids
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Topics: Impingement cooling, Nanofluids, Temperature, Heat capacity, Heat transfer coefficients, Collisions (Physics), Fluids, Heat transfer, Heating, Jets
Proceedings Papers

The Local and Average Heat Transfer Characteristic of Confined Jet Array Impingement Boiling of Aqueous Ethylene Glycol Solutions

F. J. Hong, C. Y. Zhang, W. He, P. Cheng, G. Chen
Proc. ASME. MNHMT2013, ASME 2013 4th International Conference on Micro/Nanoscale Heat and Mass Transfer, V001T11A013, December 11–14, 2013
Publisher: American Society of Mechanical Engineers
Paper No: MNHMT2013-22260
https://doi.org/10.1115/MNHMT2013-22260
View Paper titled, The Local and Average Heat Transfer Characteristic of Confined Jet Array Impingement Boiling of Aqueous Ethylene Glycol Solutions
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Topics: Boiling, Heat transfer, Heating, Cooling, Critical heat flux, Jets, Subcooling, Temperature, Wall temperature, Atmospheric pressure
Proceedings Papers

Numerical Study on Substrate Remelting, Flow, and Resolidification in Microcasting

F. J. Hong, H.-H. Qiu
Proc. ASME. HT-FED2004, Volume 3, 1045-1053, July 11–15, 2004
Publisher: American Society of Mechanical Engineers
Paper No: HT-FED2004-56621
https://doi.org/10.1115/HT-FED2004-56621
View Paper titled, Numerical Study on Substrate Remelting, Flow, and Resolidification in Microcasting
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Topics: Flow (Dynamics), Drops, Contact resistance, Computer simulation, Fluid dynamics, Shapes, Simulation results, Superheating, Temperature
Proceedings Papers

Design of a Fractal Tree-Like Microchannel Net Heat Sink for Microelectronic Cooling

F. J. Hong, P. Cheng, H. Ge, Teck Joo Goh
Proc. ASME. ICNMM2006, ASME 4th International Conference on Nanochannels, Microchannels, and Minichannels, Parts A and B, 305-311, June 19–21, 2006
Publisher: American Society of Mechanical Engineers
Paper No: ICNMM2006-96157
https://doi.org/10.1115/ICNMM2006-96157
View Paper titled, Design of a Fractal Tree-Like Microchannel Net Heat Sink for Microelectronic Cooling
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Topics: Cooling, Design, Fractals, Heat sinks, Microchannels, Dimensions, Heat transfer, Pressure drop, Water, Computer cooling
Journal Articles

Characterization of Variable Thermal Contact Resistance in Rapid Contact Solidification Utilizing Novel Ultrasound Technique

F. J. Hong, H.-H. Qiu
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Papers
J. Heat Mass Transfer. August 2007, 129(8): 1036–1045.
https://doi.org/10.1115/1.2724848
Published Online: September 21, 2006
View Articletitled, Characterization of Variable Thermal Contact Resistance in Rapid Contact Solidification Utilizing Novel Ultrasound Technique
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Topics: Contact resistance, Heat transfer, Solidification, Temperature, Ultrasound, Metals