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Journal Articles

Optimized Design of Various Ag Decorated Sn-xAg-Cu 0.7 Solder Bump on Cycling Fatigue Reliability for Wafer-Level Chip Scale Packaging

H. T. Lee, C. Y. Ho, C. C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041001.
Paper No: EP-21-1043
https://doi.org/10.1115/1.4052075
Published Online: October 6, 2021
View Article titled, Optimized Design of Various Ag Decorated Sn-xAg-Cu 0.7 Solder Bump on Cycling Fatigue Reliability for Wafer-Level Chip Scale Packaging
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Topics: Fatigue, Solders, Tin, Displacement, Fracture (Materials), Intermetallic compounds, Packaging, Reliability, Temperature
Journal Articles

Cerebrospinal Fluid Pressures Resulting From Experimental Traumatic Spinal Cord Injuries in a Pig Model

Claire F. Jones, Jae H. T. Lee, Uri Burstyn, Elena B. Okon, Brian K. Kwon, Peter A. Cripton
Journal: Journal of Biomechanical Engineering
Publisher: ASME
Article Type: Research-Article
J Biomech Eng. October 2013, 135(10): 101005.
Paper No: BIO-12-1190
https://doi.org/10.1115/1.4025100
Published Online: September 20, 2013
View Article titled, Cerebrospinal Fluid Pressures Resulting From Experimental Traumatic Spinal Cord Injuries in a Pig Model
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Topics: Pressure, Wounds, Spinal cord, Impulse (Physics), Waves
Journal Articles

Effect of Material Physical Properties on Residual Stress Measurement by EDM Hole-Drilling Method

H. T. Lee, T. Y. Tai, C. Liu, F. C. Hsu, J. M. Hsu
Journal: Journal of Engineering Materials and Technology
Publisher: ASME
Article Type: Research Papers
J. Eng. Mater. Technol. April 2011, 133(2): 021014.
https://doi.org/10.1115/1.4000219
Published Online: March 21, 2011
View Article titled, Effect of Material Physical Properties on Residual Stress Measurement by EDM Hole-Drilling Method
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Topics: Calibration, Drilling, Electrical discharge machining, Machining, Strain gages, Stress, Thermal conductivity, Carbon
Journal Articles

Analysis for Cold Die Compaction of Stainless-Steel Powder

Y. S. Kwon, H. T. Lee, K. T. Kim
Journal: Journal of Engineering Materials and Technology
Publisher: ASME
Article Type: Technical Papers
J. Eng. Mater. Technol. October 1997, 119(4): 366–373.
https://doi.org/10.1115/1.2812271
Published Online: October 1, 1997
View Article titled, Analysis for Cold Die Compaction of Stainless-Steel Powder
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Topics: Compacting, Stainless steel, Die pressing, Finite element analysis, Friction, Pressure, Constitutive equations, Deformation