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1-20 of 22
Jimil M. Shah
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Proceedings Papers
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A021, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-96370
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2023, 145(4): 041101.
Paper No: EP-22-1089
Published Online: May 15, 2023
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2022, 144(2): 024501.
Paper No: EP-21-1070
Published Online: January 28, 2022
Journal Articles
Jimil M. Shah, Keerthivasan Padmanaban, Hrishabh Singh, Surya Duraisamy Asokan, Satyam Saini, Dereje Agonafer
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021109.
Paper No: EP-21-1016
Published Online: October 14, 2021
Journal Articles
Satyam Saini, Jimil M. Shah, Pardeep Shahi, Pratik Bansode, Dereje Agonafer, Prabjit Singh, Roger Schmidt, Mike Kaler
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. September 2022, 144(3): 030801.
Paper No: EP-20-1054
Published Online: September 15, 2021
Journal Articles
Jimil M. Shah, Roshan Anand, Prabjit Singh, Satyam Saini, Rawhan Cyriac, Dereje Agonafer, Mike Kaler
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041103.
Paper No: EP-19-1096
Published Online: June 23, 2020
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2020, 142(2): 024501.
Paper No: EP-19-1015
Published Online: April 6, 2020
Proceedings Papers
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A017, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6602
Topics:
Cooling
Proceedings Papers
Dhruvkumar Gandhi, Uschas Chowdhury, Tushar Chauhan, Pratik Bansode, Satyam Saini, Jimil M. Shah, Dereje Agonafer
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A013, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6587
Proceedings Papers
Pravin A. Shinde, Pratik V. Bansode, Satyam Saini, Rajesh Kasukurthy, Tushar Chauhan, Jimil M. Shah, Dereje Agonafer
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A014, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6590
Proceedings Papers
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A015, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6600
Proceedings Papers
Jimil M. Shah, Roshan Anand, Satyam Saini, Rawhan Cyriac, Dereje Agonafer, Prabjit Singh, Mike Kaler
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A016, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6601
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011010.
Paper No: EP-18-1094
Published Online: November 8, 2019
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031003.
Paper No: EP-18-1103
Published Online: May 8, 2019
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2019, 141(2): 021007.
Paper No: EP-18-1050
Published Online: April 10, 2019
Proceedings Papers
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A010, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8432
Journal Articles
Jimil M. Shah, Oluwaseun Awe, Betsegaw Gebrehiwot, Dereje Agonafer, Prabjit Singh, Naveen Kannan, Mike Kaler
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020903.
Paper No: EP-16-1143
Published Online: April 24, 2017
Proceedings Papers
Jimil M. Shah, Oluwaseun Awe, Pavan Agarwal, Iziren Akhigbe, Dereje Agonafer, Prabjit Singh, Naveen Kannan, Mike Kaler
Proc. ASME. IMECE2016, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A052, November 11–17, 2016
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2016-66199
Proceedings Papers
Jimil M. Shah, Syed Haider I. Rizvi, Indu Sravani Kota, Sahithi Reddy Nagilla, Dhaval Thakkar, Dereje Agonafer
Proc. ASME. IMECE2016, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A054, November 11–17, 2016
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2016-67320
Proceedings Papers
Proc. ASME. IMECE2016, Volume 12: Transportation Systems, V012T16A029, November 11–17, 2016
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2016-68128
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