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Joshua Gess
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Proceedings Papers

Cooling of High Powered GPUs Using Liquid Nitrogen Cold Plates Made With Additive Manufacturing

Alec Nordlund, Rachel McAfee, Rebecca Ledsham, Joshua Gess
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A018, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74108
https://doi.org/10.1115/IPACK2021-74108
View Paper titled, Cooling of High Powered GPUs Using Liquid Nitrogen Cold Plates Made With Additive Manufacturing
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Topics: Additive manufacturing, Cooling, Graphics processing units, Nitrogen, Plates (structures)
Journal Articles

Viability of Cryogenic Cooling to Reduce Processor Power Consumption

Alec Nordlund, Matthew Harrison, Joshua Gess
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041101.
Paper No: EP-21-1034
https://doi.org/10.1115/1.4051752
Published Online: August 9, 2021
View Articletitled, Viability of Cryogenic Cooling to Reduce Processor Power Consumption
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Topics: Coolants, Cooling, Energy consumption, Flow (Dynamics), Nitrogen, Temperature, Design, Leakage, Solenoids, Thermal stability
Journal Articles

Analytical Model Quantifying the Net Coolant Flow Rate to a Microstructured Copper Surface Validated With Two-Phase Particle Image Velocimetry Measurements

Matthew Harrison, Joshua Gess
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. July 2021, 143(7): 072501.
Paper No: HT-20-1405
https://doi.org/10.1115/1.4050720
Published Online: May 17, 2021
View Articletitled, Analytical Model Quantifying the Net Coolant Flow Rate to a Microstructured Copper Surface Validated With Two-Phase Particle Image Velocimetry Measurements
Open the PDF for Analytical Model Quantifying the Net Coolant Flow Rate to a Microstructured Copper Surface Validated With Two-Phase Particle Image Velocimetry Measurements in another window
Topics: Boiling, Bubbles, Coolants, Flow (Dynamics), Fluids, Particulate matter, Copper, Nucleation (Physics)
Journal Articles

Single- and Two-Phase Particle Image Velocimetry Characterization of Fluid Flow Within a Liquid Immersion Cooled Electronics Module

Joshua Gess, Sushil Bhavnani, R. Wayne Johnson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2016, 138(4): 041007.
Paper No: EP-16-1051
https://doi.org/10.1115/1.4034854
Published Online: October 20, 2016
View Articletitled, Single- and Two-Phase Particle Image Velocimetry Characterization of Fluid Flow Within a Liquid Immersion Cooled Electronics Module
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Topics: Coolants, Electronics, Flow (Dynamics), Fluids, Particulate matter, Design, Boiling, Fluid dynamics, Cooling
Proceedings Papers

A Numerical Study of Multiphase Dielectric Fluid Immersion Cooling of Multichip Modules Including Effects of Nucleation Site Density and Bubble Departure Diameter Functions

Jonathan Nguyen, Roy W. Knight, Sushil H. Bhavnani, Daniel K. Harris, Seth Fincher, Joshua Gess, Aravind Sridhar
Proc. ASME. IMECE2015, Volume 8A: Heat Transfer and Thermal Engineering, V08AT10A032, November 13–19, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2015-51999
https://doi.org/10.1115/IMECE2015-51999
View Paper titled, A Numerical Study of Multiphase Dielectric Fluid Immersion Cooling of Multichip Modules Including Effects of Nucleation Site Density and Bubble Departure Diameter Functions
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Topics: Bubbles, Cooling, Density, Fluids, Multi-chip modules, Nucleation (Physics), Boiling, Flux (Metallurgy), Heat, Printed circuit boards
Proceedings Papers

Effect of Flow Guide Integration on the Thermal Performance of High Performance Liquid Cooled Immersion Server Modules

Joshua Gess, Tyler Dreher, Sushil Bhavnani, Wayne Johnson
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A047, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48771
https://doi.org/10.1115/IPACK2015-48771
View Paper titled, Effect of Flow Guide Integration on the Thermal Performance of High Performance Liquid Cooled Immersion Server Modules
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Topics: Flow (Dynamics), Coolants, Pressure drop, Temperature, Energy dissipation, Fluids, Boiling, Cooling, Data centers, Design
Proceedings Papers

Thermal Resistance and PIV Characterization of a Line-Replaceable Compact Liquid-Cooled Server Module for High Performance Computing Platforms

Joshua Gess, Sushil H. Bhavnani, R. Wayne Johnson
Proc. ASME. IMECE2014, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A084, November 14–20, 2014
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2014-38866
https://doi.org/10.1115/IMECE2014-38866
View Paper titled, Thermal Resistance and PIV Characterization of a Line-Replaceable Compact Liquid-Cooled Server Module for High Performance Computing Platforms
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Topics: Thermal resistance, Data centers, Flow (Dynamics), Fluid dynamics, Heat, Condensation, Design, Electronics, Energy consumption, Energy resources