1-10 of 10
Junghyun Cho
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Processing and Microstructure Evolution in EB-PVD TBCs

Scott G. Terry, Junghyun Cho, Carlos G. Levi
Proc. ASME. IMECE2000, Materials: Book of Abstracts, 79, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-2683
https://doi.org/10.1115/IMECE2000-2683
View Paper titled, Processing and Microstructure Evolution in EB-PVD TBCs
Open the PDF for Processing and Microstructure Evolution in EB-PVD TBCs in another window
Topics: Cathode ray oscilloscopes, Diffusion (Physics), Electron beams, Modeling, Porosity, Surface topography, Temperature, Thermal barrier coatings, Thermal conductivity, Vapor deposition
Journal Articles

Lead-Free Alternatives for Interconnects in High-Temperature Electronics

Sandeep Mallampati, Liang Yin, David Shaddock, Harry Schoeller, Junghyun Cho
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010906.
Paper No: EP-17-1101
https://doi.org/10.1115/1.4039027
Published Online: March 2, 2018
View Articletitled, Lead-Free Alternatives for Interconnects in High-Temperature Electronics
Open the PDF for Lead-Free Alternatives for Interconnects in High-Temperature Electronics in another window
Topics: Alloys, Electronics, High temperature, Solders, Temperature, Testing, Thermal conductivity, Failure, Melting, Tensile testing
Proceedings Papers

Lead-Free Alternatives for Interconnects in High-Temperature Electronics

Sandeep Mallampati, Liang Yin, David Shaddock, Harry Schoeller, Junghyun Cho
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A004, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74169
https://doi.org/10.1115/IPACK2017-74169
View Paper titled, Lead-Free Alternatives for Interconnects in High-Temperature Electronics
Open the PDF for Lead-Free Alternatives for Interconnects in High-Temperature Electronics in another window
Topics: Electronics, High temperature, Alloys, Fracture (Materials), Deformation, Shear strength, Solders, Tension, Thermal conductivity, Brittleness
Proceedings Papers

Effects of Microstructure Evolution on High-Temperature Mechanical Deformation of 95Sn-5Sb

Harry Schoeller, Shubhra Bansal, Aaron Knobloch, David Shaddock, Junghyun Cho
Proc. ASME. IMECE2008, Volume 6: Electronics and Photonics, 25-32, October 31–November 6, 2008
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2008-68952
https://doi.org/10.1115/IMECE2008-68952
View Paper titled, Effects of Microstructure Evolution on High-Temperature Mechanical Deformation of 95Sn-5Sb
Open the PDF for Effects of Microstructure Evolution on High-Temperature Mechanical Deformation of 95Sn-5Sb in another window
Topics: Deformation, High temperature, Solders, Creep, Temperature, Alloys, Electronics, Stress, Tin, Drilling
Proceedings Papers

Constitutive Relations of High Temperature Solders

Harry Schoeller, Shubhra Bansal, Aaron Knobloch, David Shaddock, Junghyun Cho
Proc. ASME. IMECE2007, Volume 5: Electronics and Photonics, 201-208, November 11–15, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2007-42215
https://doi.org/10.1115/IMECE2007-42215
View Paper titled, Constitutive Relations of High Temperature Solders
Open the PDF for Constitutive Relations of High Temperature Solders in another window
Topics: Constitutive equations, High temperature, Solders, Wire, Nanoindentation, Creep, Failure, Finite element analysis, Mechanical properties, Temperature
Proceedings Papers

Protection From Oxygen and Moisture Via Thin Oxide Barrier Coating for Organic Electronics

Hyungsuk Lee, Guangneng Zhang, Junghyun Cho
Proc. ASME. IMECE2007, Volume 5: Electronics and Photonics, 209-214, November 11–15, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2007-42509
https://doi.org/10.1115/IMECE2007-42509
View Paper titled, Protection From Oxygen and Moisture Via Thin Oxide Barrier Coating for Organic Electronics
Open the PDF for Protection From Oxygen and Moisture Via Thin Oxide Barrier Coating for Organic Electronics in another window
Topics: Coatings, Electronics, Oxygen, Atomic force microscopy, Biomimetics, Failure, Functional materials, High temperature, Interface structure, Light-emitting diodes
Proceedings Papers

Aligned Carbon Nanotube Polymer Composites

Yayong Liu, Narayan C. Das, Howard Wang, Guangneng Zhang, Junghyun Cho, Kunlun Hong, Gyula Eres, David Uhrig
Proc. ASME. IMECE2007, Volume 5: Electronics and Photonics, 55-58, November 11–15, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2007-43776
https://doi.org/10.1115/IMECE2007-43776
View Paper titled, Aligned Carbon Nanotube Polymer Composites
Open the PDF for Aligned Carbon Nanotube Polymer Composites in another window
Topics: Carbon nanotubes, Polymer composites, Composite materials, Polymer nanocomposites, Density, Dielectric relaxation, Elastic moduli, Mechanical behavior, Nanoindentation, Neutron diffraction
Proceedings Papers

Development of Protective Coatings for Silicon Devices

Quan Yang, Kaustubh Chitre, Tolulope O. Salami, Scott R. Oliver, Junghyun Cho
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 373-380, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-41700
https://doi.org/10.1115/IMECE2003-41700
View Paper titled, Development of Protective Coatings for Silicon Devices
Open the PDF for Development of Protective Coatings for Silicon Devices in another window
Topics: Protective coatings, Silicon, Ceramic coatings, Coating processes, Coatings, High temperature, Self-assembly, Atomic force microscopy, Brittleness, Computer simulation
Proceedings Papers

Development of Conformal PDMS and Parylene Coatings for Microelectronics and MEMS Packaging

Hyungsuk Lee, Junghyun Cho
Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 279-283, November 5–11, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2005-82955
https://doi.org/10.1115/IMECE2005-82955
View Paper titled, Development of Conformal PDMS and Parylene Coatings for Microelectronics and MEMS Packaging
Open the PDF for Development of Conformal PDMS and Parylene Coatings for Microelectronics and MEMS Packaging in another window
Topics: Coatings, MEMS packaging, Microelectronic devices, Plasma desorption mass spectrometry, Packaging, Mechanical properties, Atomic force microscopy, Microelectromechanical systems, Nanoindentation, Electronic packaging
Proceedings Papers

Solderability of Indium With Various Oxide Thickness

Seungbae Park, Jongman Kim, Junghyun Cho, Harry Schoeller
Proc. ASME. IMECE2006, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 155-159, November 5–10, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2006-16271
https://doi.org/10.1115/IMECE2006-16271
View Paper titled, Solderability of Indium With Various Oxide Thickness
Open the PDF for Solderability of Indium With Various Oxide Thickness in another window
Topics: Solders, Stress, Wetting