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Kenneth T. Kiger
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Proceedings Papers

Heat Transfer Characteristics of Single Droplet Cooling Using a Microscale Heater Array

Jungho Lee, Jungho Kim, Kenneth T. Kiger, Bohumil Horacek
Proc. ASME. IMECE2000, Heat Transfer: Volume 3, 389-396, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1497
https://doi.org/10.1115/IMECE2000-1497
View Paper titled, Heat Transfer Characteristics of Single Droplet Cooling Using a Microscale Heater Array
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Topics: Cooling, Drops, Heat transfer, Microscale devices, Heat, Boiling, Evaporation, Failure, Flux (Metallurgy), Heat flux
Proceedings Papers

Pool Boiling Mechanism of HFE-7100

Saeed Moghaddam, Kenneth T. Kiger
Proc. ASME. HT-FED2004, Volume 4, 309-316, July 11–15, 2004
Publisher: American Society of Mechanical Engineers
Paper No: HT-FED2004-56145
https://doi.org/10.1115/HT-FED2004-56145
View Paper titled, Pool Boiling Mechanism of HFE-7100
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Topics: Pool boiling, Bubbles, Membranes, Boiling, Cavities, Heat flux, Resistance thermometers, Silicon, Superheating, Temperature
Proceedings Papers

Spray Cooling Using Multiple Nozzles: Visualization and Wall Heat Transfer Measurements

Bohumil Horacek, Jungho Kim, Kenneth T. Kiger
Proc. ASME. HT-FED2004, Volume 3, 437-451, July 11–15, 2004
Publisher: American Society of Mechanical Engineers
Paper No: HT-FED2004-56163
https://doi.org/10.1115/HT-FED2004-56163
View Paper titled, Spray Cooling Using Multiple Nozzles: Visualization and Wall Heat Transfer Measurements
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Topics: Cooling, Heat transfer, Nozzles, Sprays, Visualization, Heat flux, Reflectance
Proceedings Papers

Experimental Study of Microscale Bubble Growth and Departure Dynamic Over a Surface With Constant Heat Flux Boundary Condition

Saeed Moghaddam, Kenneth T. Kiger
Proc. ASME. HT2003, Heat Transfer: Volume 2, 435-438, July 21–23, 2003
Publisher: American Society of Mechanical Engineers
Paper No: HT2003-47240
https://doi.org/10.1115/HT2003-47240
View Paper titled, Experimental Study of Microscale Bubble Growth and Departure Dynamic Over a Surface With Constant Heat Flux Boundary Condition
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Topics: Boundary-value problems, Bubbles, Heat flux, Microscale devices, Heat transfer, Boiling, Nucleate boiling, Convection, Dynamics (Mechanics), Heat transfer coefficients
Proceedings Papers

Fabrication and Testing of a Novel Microelectromechnical Device for the Study of Boiling Bubble Dynamics

Saeed Moghaddam, Kenneth T. Kiger, Jean-Marc Henriette, Michael Ohadi
Proc. ASME. IMECE2003, Microelectromechanical Systems, 107-114, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-42303
https://doi.org/10.1115/IMECE2003-42303
View Paper titled, Fabrication and Testing of a Novel Microelectromechnical Device for the Study of Boiling Bubble Dynamics
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Topics: Boiling, Bubbles, Dynamics (Mechanics), Manufacturing, Testing, Temperature, Cavities, Diaphragms (Mechanical devices), Diaphragms (Structural), Sensors
Proceedings Papers

Effects of Noncondensable Gas and Subcooling on the Spray Cooling of an Isothermal Surface

Bohumil Horacek, Jungho Kim, Kenneth T. Kiger
Proc. ASME. IMECE2003, Heat Transfer, Volume 4, 69-77, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-41680
https://doi.org/10.1115/IMECE2003-41680
View Paper titled, Effects of Noncondensable Gas and Subcooling on the Spray Cooling of an Isothermal Surface
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Topics: Cooling, Sprays, Subcooling, Heat transfer, Circuits, Critical heat flux, Feedback, Flow (Dynamics), Nozzles, Platinum
Proceedings Papers

Spray Cooling of Small-Pitched, Straight-Finned, Copper Heat Sinks

Johnathan S. Coursey, Jungho Kim, Kenneth T. Kiger
Proc. ASME. IMECE2005, Heat Transfer, Part B, 271-277, November 5–11, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2005-81210
https://doi.org/10.1115/IMECE2005-81210
View Paper titled, Spray Cooling of Small-Pitched, Straight-Finned, Copper Heat Sinks
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Topics: Cooling, Copper, Heat sinks, Sprays, Fins, Critical heat flux, Dielectric liquids, Electrical discharge machining, Electronics, Flow (Dynamics)
Proceedings Papers

Microscale Study of the Boiling Process in Low-Surface-Tension Fluids

Saeed Moghaddam, Kenneth T. Kiger
Proc. ASME. IMECE2006, Heat Transfer, Volume 2, 417-425, November 5–10, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2006-16267
https://doi.org/10.1115/IMECE2006-16267
View Paper titled, Microscale Study of the Boiling Process in Low-Surface-Tension Fluids
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Topics: Boiling, Fluids, Microscale devices, Tension, Bubbles, Temperature, Heat transfer, Nucleation (Physics), Resolution (Optics), Sensors
Journal Articles

Spray Cooling of High Aspect Ratio Open Microchannels

Johnathan S. Coursey, Jungho Kim, Kenneth T. Kiger
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Papers
J. Heat Mass Transfer. August 2007, 129(8): 1052–1059.
https://doi.org/10.1115/1.2737476
Published Online: January 18, 2007
View Articletitled, Spray Cooling of High Aspect Ratio Open Microchannels
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Topics: Cooling, Nozzles, Sprays, Fins, Heat, Pressure, Microchannels, Heat sinks, Temperature