Skip Nav Destination
Close Modal
Update search
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
NARROW
Format
Publisher
Journal
Article Type
Conference Series
Subject Area
Topics
Date
Availability
1-17 of 17
Kourosh Nemati
Close
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Sort by
Journal Articles
Vahideh Radmard, Ahmad R. Gharaibeh, Mohammad I. Tradat, Cong. H. Hoang, Yaman Yaseen Manaserh, Kourosh Nemati, Scott N. Schiffres, Bahgat G. Sammakia
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021001.
Paper No: EP-22-1003
Published Online: August 8, 2022
Journal Articles
Mohammad I. Tradat, Yaman “Mohammad Ali” Manaserh, Ahmad Gharaibeh, Bahgat G. Sammakia, Dave Hall, Kourosh Nemati, Mark Seymour
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031015.
Paper No: EP-21-1151
Published Online: March 8, 2022
Journal Articles
Ghazal Mohsenian, Cong Hiep Hoang, Kourosh Nemati, Hussam Alissa, Mohammad Tradat, Najmeh Fallahtafti, Vahideh Radmard, Bruce Murray, Bahgat Sammakia
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041015.
Paper No: EP-21-1139
Published Online: February 23, 2022
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. October 2020, 12(5): 051009.
Paper No: TSEA-19-1389
Published Online: February 26, 2020
Journal Articles
Sadegh Khalili, Husam Alissa, Kourosh Nemati, Mark Seymour, Robert Curtis, David Moss, Bahgat Sammakia
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031004.
Paper No: EP-18-1075
Published Online: April 10, 2019
Proceedings Papers
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A006, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8334
Proceedings Papers
Sadegh Khalili, Husam Alissa, Kourosh Nemati, Mark Seymour, Robert Curtis, David Moss, Bahgat Sammakia
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A009, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8422
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010907.
Paper No: EP-17-1109
Published Online: March 2, 2018
Proceedings Papers
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A021, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74339
Proceedings Papers
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A007, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74148
Journal Articles
Kourosh Nemati, Husam A. Alissa, Bruce T. Murray, Bahgat G. Sammakia, Russell Tipton, Mark J. Seymour
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. August 2017, 139(8): 082101.
Paper No: HT-16-1281
Published Online: April 11, 2017
Proceedings Papers
Husam A. Alissa, Kourosh Nemati, Bahgat Sammakia, Kanad Ghose, Mark Seymour, David King, Russell Tipton
Proc. ASME. IMECE2015, Volume 8B: Heat Transfer and Thermal Engineering, V08BT10A043, November 13–19, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2015-50782
Proceedings Papers
Proc. ASME. IMECE2015, Volume 8B: Heat Transfer and Thermal Engineering, V08BT10A047, November 13–19, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2015-52667
Proceedings Papers
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A016, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48234
Proceedings Papers
Husam A. Alissa, Kourosh Nemati, Bahgat Sammakia, Alfonso Ortega, David King, Mark Seymour, Russell Tipton
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A017, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48237
Proceedings Papers
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A041, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48244
Proceedings Papers
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A034, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48684