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1-6 of 6
Manoj Nagulapally
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Proceedings Papers
Proc. ASME. IMECE2011, Volume 6: Fluids and Thermal Systems; Advances for Process Industries, Parts A and B, 1381-1388, November 11–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2011-65626
Proceedings Papers
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 487-491, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73365
Proceedings Papers
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 411-416, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35196
Proceedings Papers
Proc. ASME. HT2003, Heat Transfer: Volume 3, 379-387, July 21–23, 2003
Publisher: American Society of Mechanical Engineers
Paper No: HT2003-47015
Proceedings Papers
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 671-677, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-42372
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 472–476.
Published Online: January 24, 2005