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Mohammad Motalab
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Proceedings Papers

Effects of Cooling Rate on the Stress-Strain Behavior of SAC305 Solder: An Atomistic Study

Sadib Fardin, Md. Jawarul Moresalein, Mohammad Motalab
Proc. ASME. IMECE2023, Volume 12: Micro- and Nano-Systems Engineering and Packaging, V012T13A019, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-114426
https://doi.org/10.1115/IMECE2023-114426
View Paper titled, Effects of Cooling Rate on the Stress-Strain Behavior of SAC305 Solder: An Atomistic Study
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Topics: Cooling, Solders, Stress
Proceedings Papers

Atomistic Study on the Cooling Rate Induced Mechanical Properties Variations in Additively Manufactured Inconel-718

Toushiqul Islam, Md Samin Ashiq Aziz, Mohammad Motalab, Abrar Faiyad
Proc. ASME. IMECE2023, Volume 4: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V004T04A031, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-114456
https://doi.org/10.1115/IMECE2023-114456
View Paper titled, Atomistic Study on the Cooling Rate Induced Mechanical Properties Variations in Additively Manufactured Inconel-718
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Topics: Additive manufacturing, Cooling, Mechanical properties
Proceedings Papers

Atomistic Investigation on Mechanical Properties of Sn-Ag-Cu Based Nanocrystalline Solder Material

Mohammad Motalab, Rafsan A. S. I. Subad, Ayesha Ahmed, Pritom Bose, Ratul Paul, Jeffrey C. Suhling
Proc. ASME. IMECE2019, Volume 12: Advanced Materials: Design, Processing, Characterization, and Applications, V012T10A035, November 11–14, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2019-12109
https://doi.org/10.1115/IMECE2019-12109
View Paper titled, Atomistic Investigation on Mechanical Properties of Sn-Ag-Cu Based Nanocrystalline Solder Material
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Topics: Mechanical properties, Solders, Tin, Tensile strength, Simulation, Temperature, Atoms, Crystals, Ductility, Electrical components
Proceedings Papers

Numerical Investigation on Electromigration Oriented Failure of Lead Free Solder Joints With Aging Effects

Tusher Ahmed, Mohammad Motalab, Jeffrey C. Suhling
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A024, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6521
https://doi.org/10.1115/IPACK2019-6521
View Paper titled, Numerical Investigation on Electromigration Oriented Failure of Lead Free Solder Joints With Aging Effects
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Topics: Electrodiffusion, Failure, Lead-free solders
Journal Articles

Erratum: “Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors” [ASME J. Electron. Packag., 2014, 136(4), p. 041014; DOI: 10.1115/1.4028333 ]

Richard C. Jaeger, Mohammad Motalab, Safina Hussain, Jeffrey C. Suhling
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Errata
J. Electron. Packag. March 2018, 140(1): 017001.
Paper No: EP-17-1111
https://doi.org/10.1115/1.4038735
Published Online: March 2, 2018
View Articletitled, Erratum: “Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors” [ASME J. Electron. Packag., 2014, 136(4), p. 041014; DOI: 10.1115/1.4028333 ]
Open the PDF for Erratum: “Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors” [ASME J. Electron. Packag., 2014, 136(4), p. 041014; DOI: 10.1115/1.4028333 ] in another window
Topics: Bridges (Structures), Electrons, Sensors, Silicon, Stress, Wire
Proceedings Papers

FEA Based Reliability Predictions for PBGA Packages Subjected to Isothermal Aging Prior to Thermal Cycling

Munshi Basit, Mohammad Motalab, Jeffrey C. Suhling, John L. Evans, Pradeep Lall
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A039, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48620
https://doi.org/10.1115/IPACK2015-48620
View Paper titled, FEA Based Reliability Predictions for PBGA Packages Subjected to Isothermal Aging Prior to Thermal Cycling
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Topics: Finite element analysis, Reliability, Failure, Lead-free solders, Temperature, Accelerated life testing, Ball-Grid-Array packaging, Fracture (Materials), Lumber, Modeling
Proceedings Papers

Viscoplastic Constitutive Model for Lead-Free Solder Including Effects of Silver Content, Solidification Profile, and Severe Aging

Munshi Basit, Mohammad Motalab, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A002, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48619
https://doi.org/10.1115/IPACK2015-48619
View Paper titled, Viscoplastic Constitutive Model for Lead-Free Solder Including Effects of Silver Content, Solidification Profile, and Severe Aging
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Topics: Constitutive equations, Lead-free solders, Silver, Solidification, Alloys, Mechanical properties, Water, Solders, Reliability, Stress-strain curves
Journal Articles

Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors

Richard C. Jaeger, Mohammad Motalab, Safina Hussain, Jeffrey C. Suhling
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041014.
Paper No: EP-14-1027
https://doi.org/10.1115/1.4028333
Published Online: September 19, 2014
View Articletitled, Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors
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Topics: Sensors, Silicon, Stress, Bridges (Structures), Shear stress
Proceedings Papers

Thermal Cycling Reliability Predictions for PBGA Assemblies That Include Aging Effects

Mohammad Motalab, Muhannad Mustafa, Jeffrey C. Suhling, Jiawei Zhang, John Evans, Michael J. Bozack, Pradeep Lall
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A008, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73230
https://doi.org/10.1115/IPACK2013-73230
View Paper titled, Thermal Cycling Reliability Predictions for PBGA Assemblies That Include Aging Effects
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Topics: Energy dissipation, Lead-free solders, Reliability, Solders
Proceedings Papers

A Revised Anand Constitutive Model for Lead Free Solder That Includes Aging Effects

Mohammad Motalab, Munshi Basit, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A009, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73232
https://doi.org/10.1115/IPACK2013-73232
View Paper titled, A Revised Anand Constitutive Model for Lead Free Solder That Includes Aging Effects
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Topics: Constitutive equations, Lead-free solders
Proceedings Papers

Measurement of Microprocessor Die Stress due to Thermal Cycling, Power Cycling, and Second Level Assembly

Jordan C. Roberts, Mohammad Motalab, Safina Hussain, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T01A005, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73244
https://doi.org/10.1115/IPACK2013-73244
View Paper titled, Measurement of Microprocessor Die Stress due to Thermal Cycling, Power Cycling, and Second Level Assembly
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Topics: Flip-chip, Flip-chip devices, Manufacturing, Sensors, Stress
Proceedings Papers

Four-Wire Bridge Measurements of van der Pauw Stress Sensors on (100) and (111) Silicon

Richard C. Jaeger, Mohammad Motalab, Safina Hussain, Jeffrey C. Suhling
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T06A003, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73249
https://doi.org/10.1115/IPACK2013-73249
View Paper titled, Four-Wire Bridge Measurements of van der Pauw Stress Sensors on (100) and (111) Silicon
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Topics: Bridges (Structures), Sensors, Silicon, Stress, Wire
Journal Articles

Characterization of Compressive Die Stresses in CBGA Microprocessor Packaging Due to Component Assembly and Heat Sink Clamping

Jordan C. Roberts, Mohammad Motalab, Safina Hussain, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2012, 134(3): 031005.
https://doi.org/10.1115/1.4006910
Published Online: July 18, 2012
View Articletitled, Characterization of Compressive Die Stresses in CBGA Microprocessor Packaging Due to Component Assembly and Heat Sink Clamping
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Topics: Stress, Manufacturing, Packaging, Sensors, Heat sinks
Proceedings Papers

Characterization of Die Stresses in CBGA Packages due to Component Assembly and Heat Sink Clamping

Jordan C. Roberts, Mohammad Motalab, Safina Hussain, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 493-506, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52185
https://doi.org/10.1115/IPACK2011-52185
View Paper titled, Characterization of Die Stresses in CBGA Packages due to Component Assembly and Heat Sink Clamping
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Topics: Heat sinks, Manufacturing, Packaging, Sensors, Stress