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Nobuyuki Shishido
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Journal Articles

Application of the Nonlinear Fracture Mechanics Parameter Δ T * to Wire-Liftoff Lifetime Estimation of Power Modules at Elevated Temperatures

Nobuyuki Shishido, Yutaka Hayama, Yuki Akinaga, Shinya Taketomi, Masaaki Koganemaru, Seiya Hagihara, Noriyuki Miyazaki
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011010.
Paper No: EP-24-1039
https://doi.org/10.1115/1.4066100
Published Online: August 24, 2024
View Article titled, Application of the Nonlinear Fracture Mechanics Parameter Δ T * to Wire-Liftoff Lifetime Estimation of Power Modules at Elevated Temperatures
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Topics: Creep, Cycles, Fatigue, Fracture (Materials), Fracture mechanics, Temperature, Wire, Computational methods, Finite element analysis
Journal Articles

Review of Methodologies for Structural Integrity Evaluation of Power Modules

Noriyuki Miyazaki, Nobuyuki Shishido, Yutaka Hayama
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2021, 143(2): 020801.
Paper No: EP-20-1074
https://doi.org/10.1115/1.4048038
Published Online: August 27, 2020
View Article titled, Review of Methodologies for Structural Integrity Evaluation of Power Modules
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Topics: Cracking (Materials), Creep, Cycles, Density, Failure, Fatigue, Fracture (Materials), Fracture (Process), Temperature, Wire
Proceedings Papers

Effect of Hydrogen on the Mechanical Properties of Silicon Crystal Surface

Hayato Izumi, Ryota Mukaiyama, Nobuyuki Shishido, Shoji Kamiya
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T06A008, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73324
https://doi.org/10.1115/IPACK2013-73324
View Paper titled, Effect of Hydrogen on the Mechanical Properties of Silicon Crystal Surface
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Topics: Hydrogen, Mechanical properties, Silicon crystals, Silicon, Atoms, Boiling, Boron, Deformation, Plasticity, Stress
Proceedings Papers

Interface Toughness Evaluation With Specimens Fabricated by Focused Ion Beam for Micro Scale Devices and Packages

Nobuyuki Shishido, Satoru Matsumoto, Chuantong Chen, Hisashi Sato, Masaki Omiya, Shoji Kamiya, Masahiro Nishida, Takeshi Nokuo, Tadahiro Nagasawa, Takashi Suzuki, Tomoji Nakamura
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 425-428, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52270
https://doi.org/10.1115/IPACK2011-52270
View Paper titled, Interface Toughness Evaluation With Specimens Fabricated by Focused Ion Beam for Micro Scale Devices and Packages
Open the PDF for Interface Toughness Evaluation With Specimens Fabricated by Focused Ion Beam for Micro Scale Devices and Packages in another window
Topics: Electromagnetic scattering, Focused ion beams, Fracture toughness, Microscale devices, Resolution (Optics), Uncertainty, Vapors