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Journal Articles

StepIdeator: Utilizing Mixed Representations to Support Step-By-Step Design With Generative Artificial Intelligence

Jiayi Yao, Pei Chen, Zhuoshu Li, Yichen Cai, Yexinrui Wu, Weitao You, Lingyun Sun
Journal: Journal of Mechanical Design
Publisher: ASME
Article Type: Research Papers
J. Mech. Des. July 2025, 147(7): 071703.
Paper No: MD-24-1285
https://doi.org/10.1115/1.4067426
Published Online: January 30, 2025
View Article titled, StepIdeator: Utilizing Mixed Representations to Support Step-By-Step Design With Generative Artificial Intelligence
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Topics: Design, Creativity
Journal Articles

Auto-Labeling for Pattern Recognition of Wafer Defect Maps in Semiconductor Manufacturing

Shu-Kai S. Fan, Pei-Chen Chen, Chih-Hung Jen, Kanchana Sethanan
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. July 2024, 146(7): 070904.
Paper No: MANU-23-1598
https://doi.org/10.1115/1.4065118
Published Online: April 22, 2024
View Article titled, Auto-Labeling for Pattern Recognition of Wafer Defect Maps in Semiconductor Manufacturing
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Topics: Semiconductor wafers, Integrated circuit fabrication
Journal Articles

An Automatic Finite Element Method-Boundary Element Method Coupling Method for Elastic–Plastic Problems of Multiscale Structures in Electronic Packaging

Fei Qin, Qi He, Yanpeng Gong, Chuantao Hou, Hao Cheng, Tong An, Yanwei Dai, Pei Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021003.
Paper No: EP-22-1036
https://doi.org/10.1115/1.4055125
Published Online: August 18, 2022
View Article titled, An Automatic Finite Element Method-Boundary Element Method Coupling Method for Elastic–Plastic Problems of Multiscale Structures in Electronic Packaging
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Topics: Boundary element methods, Finite element methods, Finite element model, Stiffness, Electronic packaging, Finite element analysis, Displacement, Traction
Journal Articles

Indentation Tests for Sintered Silver in Die-Attach Interconnection After Thermal Cycling

Fei Qin, Shuai Zhao, Yanwei Dai, Lingyun Liu, Tong An, Pei Chen, Yanpeng Gong
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031012.
Paper No: EP-21-1125
https://doi.org/10.1115/1.4053028
Published Online: December 27, 2021
View Article titled, Indentation Tests for Sintered Silver in Die-Attach Interconnection After Thermal Cycling
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Topics: Cycles, Nanoindentation, Silver, Stress, Young's modulus, Stress-strain curves
Journal Articles

Pre-Lubricated Polypropylene Injector for Breast Implant Delivery

Hsiao-Hung Chiang, Chen-Ying Su, Hsiu-Peng Lin, Chiao-Pei Chen, Ting-Chu Yu, Hsu-Wei Fang
Journal: Journal of Medical Devices
Publisher: ASME
Article Type: Research-Article
J. Med. Devices. December 2021, 15(4): 041006.
Paper No: MED-20-1182
https://doi.org/10.1115/1.4052122
Published Online: October 13, 2021
View Article titled, Pre-Lubricated Polypropylene Injector for Breast Implant Delivery
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Topics: Ejectors, Friction, Fatigue testing
Proceedings Papers

Performance Variation of Nano-Scaled Devices in 3D-IC Packaging Architecture Induced by TSV Residual Stress

Chang-Chun Lee, Pei-Chen Huang, Chi-Wei Wang
Proc. ASME. IMECE2019, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T12A004, November 11–14, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2019-10450
https://doi.org/10.1115/IMECE2019-10450
View Paper titled, Performance Variation of Nano-Scaled Devices in 3D-IC Packaging Architecture Induced by TSV Residual Stress
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Topics: Finite element analysis, Mechanical admittance, Packaging, Stress
Proceedings Papers

Stress Evaluation of Flexible Displays With Multiple-Laminations Architecture Enabled by Experimental Measurement and Simulation Based Factorial Design

Chang-Chun Lee, Pei-Chen Huang, Chi-Wei Wang, Oscar Chuang
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6541
https://doi.org/10.1115/IPACK2019-6541
View Paper titled, Stress Evaluation of Flexible Displays With Multiple-Laminations Architecture Enabled by Experimental Measurement and Simulation Based Factorial Design
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Topics: Design, Finite element analysis, Lamination, Light-emitting diodes, Simulation, Stress, Adhesives, Coatings, Fatigue, Materials properties
eBook Chapter

Heat and Mass Transfer Enhancement of Falling Film Absorption for Various Surface Geometries

Series: ASME Press Select Proceedings
Publisher: ASME Press
Published: 2009
https://doi.org/10.1115/1.802908.paper37
ISBN: 9780791802908
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Topics: Absorption, Heat, Mass transfer