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Teiichi Ando
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Journal Articles

A Numerical Investigation Into Cold Spray Bonding Processes

Baran Yildirim, Hirotaka Fukanuma, Teiichi Ando, Andrew Gouldstone, Sinan Müftü
Journal: Journal of Tribology
Publisher: ASME
Article Type: Research-Article
J. Tribol. January 2015, 137(1): 011102.
Paper No: TRIB-14-1053
https://doi.org/10.1115/1.4028471
Published Online: October 3, 2014
View Articletitled, A Numerical Investigation Into Cold Spray Bonding Processes
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Topics: Bonding, Particulate matter, Simulation
Proceedings Papers

On Simulation of Multi-Particle Impact Interactions in the Cold Spray Process

Baran Yıldırım, Andrew Hulton, Seyed Ali Alavian, Teiichi Ando, Andrew Gouldstone, Sinan Müftü
Proc. ASME. IJTC2012, ASME/STLE 2012 International Joint Tribology Conference, 83-85, October 7–10, 2012
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2012-61202
https://doi.org/10.1115/IJTC2012-61202
View Paper titled, On Simulation of Multi-Particle Impact Interactions in the Cold Spray Process
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Topics: Particulate matter, Simulation, Sprays, Deformation, Particle collisions, Bonding, Coating processes, Coatings, Cohesion, Failure
Proceedings Papers

Modeling of Droplet-Based Processing for the Production of High-Performance Particulate Materials Using Level Set Method

Pengtao Wang, Hongwei Sun, Peter Y. Wong, Hiroki Fukuda, Teiichi Ando
Proc. ASME. IMECE2008, Volume 10: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A, B, and C, 1745-1752, October 31–November 6, 2008
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2008-68014
https://doi.org/10.1115/IMECE2008-68014
View Paper titled, Modeling of Droplet-Based Processing for the Production of High-Performance Particulate Materials Using Level Set Method
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Topics: Bulk solids, Drops, Modeling, Solidification, Deformation, Heat transfer, Latent heat, Liquid metals, Simulation, Sprays
Proceedings Papers

Thermal and Mass Modeling of the Laser-Point Sealing Process in MEMS Packaging

Marios Alaeddine, Jin Zou, Rajesh Ranganathan, Charalabos C. Doumanidis, Teiichi Ando, Peter Y. Wong
Proc. ASME. HT-FED2004, Volume 3, 869-875, July 11–15, 2004
Publisher: American Society of Mechanical Engineers
Paper No: HT-FED2004-56116
https://doi.org/10.1115/HT-FED2004-56116
View Paper titled, Thermal and Mass Modeling of the Laser-Point Sealing Process in MEMS Packaging
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Topics: Lasers, MEMS packaging, Modeling, Sealing (Process), Temperature, Heat, Intermetallic compounds, Microelectromechanical systems, Heating, Melting
Journal Articles

Thermal Modeling and Control in Production of Intermetallic Coatings From Layered Precursors

Marios Alaeddine, Rajesh Ranganathan, Teiichi Ando, Charalabos C. Doumanidis
Journal: Journal of Dynamic Systems, Measurement, and Control
Publisher: ASME
Article Type: Technical Papers
J. Dyn. Sys., Meas., Control. January 2007, 129(1): 56–65.
https://doi.org/10.1115/1.2397152
Published Online: May 17, 2006
View Articletitled, Thermal Modeling and Control in Production of Intermetallic Coatings From Layered Precursors
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Topics: Coating processes, Coatings, Heat, Intermetallic compounds, Temperature, Nickel
Journal Articles

Modeling the Melting and Dissolution Stages During Thermal Processing of Intermetallic Coatings from Layered Precursors

Marios Alaeddine, Rajesh Ranganathan, Teiichi Ando, Charalabos C. Doumanidis
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Technical Papers
J. Manuf. Sci. Eng. February 2005, 127(1): 148–156.
https://doi.org/10.1115/1.1830052
Published Online: March 21, 2005
View Articletitled, Modeling the Melting and Dissolution Stages During Thermal Processing of Intermetallic Coatings from Layered Precursors
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Topics: Coating processes, Coatings, Melting, Nickel, Temperature, Heat conduction, Heat, Aluminum, Modeling, Intermetallic compounds
Journal Articles

Thermal Modeling of Deposit Solidification in Uniform Droplet Spray Forming

P. Acquaviva, Chen-An Chen, Jung-Hoon Chun, Teiichi Ando
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. August 1997, 119(3): 332–340.
https://doi.org/10.1115/1.2831111
Published Online: August 1, 1997
View Articletitled, Thermal Modeling of Deposit Solidification in Uniform Droplet Spray Forming
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Topics: Drops, Modeling, Solidification, Sprays, Temperature, Alloys, Enthalpy, Simulation, Tin, Trajectories (Physics)