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Wei Keat Loh
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Journal Articles

Experimental Method to Measure High-Temperature Hygroscopic Swelling in Epoxy Mold Compounds and Dielectric Build-Up Films

Ian Chin, Wei Keat Loh, Seow Chien Kee, Yi He, Mohd. Zulkifly Abdullah, Masahiro Tsuriya
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011009.
Paper No: EP-23-1055
https://doi.org/10.1115/1.4066083
Published Online: August 24, 2024
View Article titled, Experimental Method to Measure High-Temperature Hygroscopic Swelling in Epoxy Mold Compounds and Dielectric Build-Up Films
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Topics: Absorption, Epoxy resins, High temperature, Temperature, Thermal expansion
Proceedings Papers

Solder Joint Reliability Prediction of Flip Chip Packages Under Shock Loading Environment

Wei Keat Loh, Luke J. Garner
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1433-1440, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73213
https://doi.org/10.1115/IPACK2005-73213
View Paper titled, Solder Joint Reliability Prediction of Flip Chip Packages Under Shock Loading Environment
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Topics: Flip-chip packages, Reliability, Shock (Mechanics), Solder joints
Proceedings Papers

A Characterization Study of Flip Chip Ball Grid Array (FCBGA) Dynamic Response and Performance on Peripheral Component Interconnect (PCI) Board Application

Shaw Fong Wong, Wei Keat Loh, Yung Hsiang Lee, Eng Hooi Yap, Siang Woen Wong, Tze Yang Hin
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1441-1447, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73215
https://doi.org/10.1115/IPACK2005-73215
View Paper titled, A Characterization Study of Flip Chip Ball Grid Array (FCBGA) Dynamic Response and Performance on Peripheral Component Interconnect (PCI) Board Application
Open the PDF for A Characterization Study of Flip Chip Ball Grid Array (FCBGA) Dynamic Response and Performance on Peripheral Component Interconnect (PCI) Board Application in another window
Topics: Ball-Grid-Array packaging, Dynamic response, Flip-chip, Flip-chip devices, Fracture (Materials), Risk, Solder joints, Accelerometers, Computer software, Design
Proceedings Papers

Solder Joint Reliability Challenges in Sub 1.00 mm Ball Pitch for Flip Chip Ball Grid Array

Keh Shin Beh, Wei Keat Loh, Jenn Seong Leong, Wooi Aun Tan
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1449-1454, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73216
https://doi.org/10.1115/IPACK2005-73216
View Paper titled, Solder Joint Reliability Challenges in Sub 1.00 mm Ball Pitch for Flip Chip Ball Grid Array
Open the PDF for Solder Joint Reliability Challenges in Sub 1.00 mm Ball Pitch for Flip Chip Ball Grid Array in another window
Topics: Ball-Grid-Array packaging, Flip-chip, Flip-chip devices, Reliability, Solder joints, Heat sinks, Stress, Compression, Cycles, Electronic packages