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Y. F. Luo
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Proceedings Papers

The Diffraction Limitation on Drilling Nano-Meter Holes by Laser Irradiation

Y. F. Luo, W. Lineton
Proc. ASME. IMECE2001, Manufacturing Engineering, 427-436, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/MED-23347
https://doi.org/10.1115/IMECE2001/MED-23347
View Paper titled, The Diffraction Limitation on Drilling Nano-Meter Holes by Laser Irradiation
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Topics: Diffraction, Drilling, Irradiation (Radiation exposure), Lasers, Erosion, Wavelength, Waves, Heat conduction, Hole quality, Micromachining
Proceedings Papers

Shifting Secondary Discharge as the Expulsion Mechanism in EDM

Y. F. Luo, Jia Tao
Proc. ASME. MSEC2008, ASME 2008 International Manufacturing Science and Engineering Conference, Volume 1, 205-209, October 7–10, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MSEC_ICM&P2008-72274
https://doi.org/10.1115/MSEC_ICMP2008-72274
View Paper titled, Shifting Secondary Discharge as the Expulsion Mechanism in EDM
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Topics: Electrical discharge machining, Anodes, Machining, Copper, Electrodes, Metals, Steel
Journal Articles

Metal Removal in EDM Driven by Shifting Secondary Discharge

Y. F. Luo, Jia Tao
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. June 2009, 131(3): 031014.
https://doi.org/10.1115/1.3139225
Published Online: May 28, 2009
View Articletitled, Metal Removal in EDM Driven by Shifting Secondary Discharge
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Topics: Anodes, Electrical discharge machining, Electrodes, Machining, Metals, Plasmas (Ionized gases), Steel
Journal Articles

The Burdened Area as a Structural Indicator of Interface Bonding Strength

Y. F. Luo
Journal: Journal of Engineering Materials and Technology
Publisher: ASME
Article Type: Technical Papers
J. Eng. Mater. Technol. April 1998, 120(2): 137–142.
https://doi.org/10.1115/1.2807002
Published Online: April 1, 1998
View Articletitled, The Burdened Area as a Structural Indicator of Interface Bonding Strength
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Topics: Bonding, Adhesion, Stress, Failure, Bulk solids, Corners (Structural elements), Design engineering, Elastic moduli, Elastic plates, Failure mechanisms
Journal Articles

A Micro-Mechanics Investigation on the Bonding Strength of Heteroepitaxical Film or Strip on a Hard Substrate

Y. F. Luo, K. P. Rajurkar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1995, 117(3): 201–207.
https://doi.org/10.1115/1.2792092
Published Online: September 1, 1995
View Articletitled, A Micro-Mechanics Investigation on the Bonding Strength of Heteroepitaxical Film or Strip on a Hard Substrate
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Topics: Bonding, Micromechanics (Engineering), Strips, Separation (Technology), Adhesion, Brittleness, Deformation, Hardening, Heat treating (Metalworking), Manufacturing