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Yi-Shao Lai
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Proceedings Papers
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 9-17, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89040
Proceedings Papers
Proc. ASME. IMECE2007, Volume 5: Electronics and Photonics, 305-311, November 11–15, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2007-41232
Proceedings Papers
Proc. ASME. IMECE2007, Volume 5: Electronics and Photonics, 241-246, November 11–15, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2007-41363
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021002.
Published Online: March 27, 2009
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011001.
Published Online: February 11, 2009
Proceedings Papers
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 115-121, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35046
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2008, 130(4): 041001.
Published Online: November 13, 2008
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2007, 129(3): 366–370.
Published Online: September 12, 2006
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2007, 129(1): 105–108.
Published Online: June 6, 2006
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 56–62.
Published Online: May 19, 2006
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 98–104.
Published Online: April 18, 2006
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 281–284.
Published Online: October 7, 2005
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2004, 126(4): 560–564.
Published Online: January 24, 2005
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 135–140.
Published Online: September 28, 2004