1-2 of 2
Yifu Ding
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Understanding Mechanical Response of Porous Polymeric Stamps During Large-Area Metal-Assisted Chemical Imprinting of Silicon

Emmanuel Dasinor, Aliaksandr Sharstniou, Yifu Ding, Bruno Azeredo
Proc. ASME. MSEC2023, Volume 2: Manufacturing Equipment and Automation; Manufacturing Processes; Manufacturing Systems; Nano/Micro/Meso Manufacturing; Quality and Reliability, V002T08A008, June 12–16, 2023
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2023-106561
https://doi.org/10.1115/MSEC2023-106561
View Paper titled, Understanding Mechanical Response of Porous Polymeric Stamps During Large-Area Metal-Assisted Chemical Imprinting of Silicon
Open the PDF for Understanding Mechanical Response of Porous Polymeric Stamps During Large-Area Metal-Assisted Chemical Imprinting of Silicon in another window
Topics: Metals, Silicon, Finite element analysis, Deflection, Etching, Mechanical behavior, Membranes, Pressure, Computer software, Elasticity
Journal Articles

Time and Temperature Dependent Recovery of Epoxy-Based Shape Memory Polymers

Francisco Castro, Kristofer K. Westbrook, Jason Hermiller, Dae Up Ahn, Yifu Ding, H. Jerry Qi
Journal: Journal of Engineering Materials and Technology
Publisher: ASME
Article Type: Research Papers
J. Eng. Mater. Technol. April 2011, 133(2): 021025.
https://doi.org/10.1115/1.4003103
Published Online: March 24, 2011
View Article titled, Time and Temperature Dependent Recovery of Epoxy-Based Shape Memory Polymers
Open the PDF for Time and Temperature Dependent Recovery of Epoxy-Based Shape Memory Polymers in another window
Topics: Cycles, Epoxy adhesives, Epoxy resins, Shape memory polymers, Temperature, Heating, Deformation