1-6 of 6
Yousuke Hisakuni
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Probabilistic Reliability Analysis Method Based on Surrogate Model for Wind Turbine Drivetrain Structure Subjected to Random Dynamic Load

Tomohiko Jimbo, Akira Kano, Yousuke Hisakuni, Yasutaka Ito, Kenji Hirohata, Tsuyoshi Ichimura
Proc. ASME. IMECE2022, Volume 9: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging; Safety Engineering, Risk, and Reliability Analysis; Research Posters, V009T14A011, October 30–November 3, 2022
Paper No: IMECE2022-94043
DOI: https://doi.org/10.1115/IMECE2022-94043
View Paper titled, Probabilistic Reliability Analysis Method Based on Surrogate Model for Wind Turbine Drivetrain Structure Subjected to Random Dynamic Load
Click here to open pdf in another window PDF for Probabilistic Reliability Analysis Method Based on Surrogate Model for Wind Turbine Drivetrain Structure Subjected to Random Dynamic Load
Topics: Event history analysis, Metamodeling, Stress, Wind, Wind turbines
Proceedings Papers

Stress Concentration Mechanism in Superconducting Coil Quench Phenomenon by Large-Scale Finite Element Analysis

Yousuke Hisakuni, Akira Kano, Hideaki Uehara, Tomoko Monda, Junko Hirokawa, Osamu Nishimura, Kenji Hirohata, Toshinobu Ito, Shohei Takami, Kiyokazu Sato
Proc. ASME. IMECE2022, Volume 9: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging; Safety Engineering, Risk, and Reliability Analysis; Research Posters, V009T14A029, October 30–November 3, 2022
Paper No: IMECE2022-94914
DOI: https://doi.org/10.1115/IMECE2022-94914
View Paper titled, Stress Concentration Mechanism in Superconducting Coil Quench Phenomenon by Large-Scale Finite Element Analysis
Click here to open pdf in another window PDF for Stress Concentration Mechanism in Superconducting Coil Quench Phenomenon by Large-Scale Finite Element Analysis
Topics: Finite element analysis, Stress concentration, Wire, Crack propagation, Deformation, Resins, Acoustic emission testing, Damage, Electromagnetic force, Excitation
Proceedings Papers

Acoustic Emission Measurement and Location Analysis of Acoustic Emission Source for Superconducting Coil Quench During Training

Junko Hirokawa, Osamu Nishimura, Yousuke Hisakuni, Akira Kano, Hideaki Uehara, Tomoko Monda, Kenji Hirohata, Toshinobu Ito, Shohei Takami, Tomofumi Orikasa, Kiyokazu Sato
Proc. ASME. IMECE2022, Volume 1: Acoustics, Vibration, and Phononics, V001T01A006, October 30–November 3, 2022
Paper No: IMECE2022-91393
DOI: https://doi.org/10.1115/IMECE2022-91393
View Paper titled, Acoustic Emission Measurement and Location Analysis of Acoustic Emission Source for Superconducting Coil Quench During Training
Click here to open pdf in another window PDF for Acoustic Emission Measurement and Location Analysis of Acoustic Emission Source for Superconducting Coil Quench During Training
Topics: Acoustic emission testing, Acoustic emissions
Journal Articles

Prognostic Health Monitoring Method for Fatigue Failure of Solder Joints on Printed Circuit Boards Based on a Canary Circuit

Kenji Hirohata, Yousuke Hisakuni, Takahiro Omori
Journal: Journal of Nondestructive Evaluation, Diagnostics and Prognostics of Engineering Systems
Article Type: Research-Article
ASME J Nondestructive Evaluation. August 2018, 1(3): 031004–031004-12.
Paper No: NDE-17-1105
DOI: https://doi.org/10.1115/1.4039938
Published Online: May 3, 2018
View Article titled, Prognostic Health Monitoring Method for Fatigue Failure of Solder Joints on Printed Circuit Boards Based on a Canary Circuit
Click here to open pdf in another window PDF for Prognostic Health Monitoring Method for Fatigue Failure of Solder Joints on Printed Circuit Boards Based on a Canary Circuit
Topics: Circuits, Cycles, Failure, Fatigue, Fatigue failure, Solder joints, Stress, Fatigue life
Proceedings Papers

Prognostic Health Monitoring Method for Fatigue Failure of Solder Joints on Printed Circuit Boards Based on a Canary Circuit

Kenji Hirohata, Yousuke Hisakuni, Takahiro Omori, Tomoko Monda, Minoru Mukai
Proc. ASME. IMECE2013, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T11A082, November 15–21, 2013
Paper No: IMECE2013-65317
DOI: https://doi.org/10.1115/IMECE2013-65317
View Paper titled, Prognostic Health Monitoring Method for Fatigue Failure of Solder Joints on Printed Circuit Boards Based on a Canary Circuit
Click here to open pdf in another window PDF for Prognostic Health Monitoring Method for Fatigue Failure of Solder Joints on Printed Circuit Boards Based on a Canary Circuit
Topics: Circuits, Fatigue failure, Printed circuit boards, Solder joints, Ball-Grid-Array packaging, Stress, Density, Failure, Packaging, Probability
Proceedings Papers

Health Monitoring Method for Load Assessment and Cooling Performance Degradation of Printed Circuit Boards

Kenji Hirohata, Katsumi Hisano, Yousuke Hisakuni, Takahiro Omori, Minoru Mukai
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 469-478, November 12–18, 2010
Paper No: IMECE2010-37988
DOI: https://doi.org/10.1115/IMECE2010-37988
View Paper titled, Health Monitoring Method for Load Assessment and Cooling Performance Degradation of Printed Circuit Boards
Click here to open pdf in another window PDF for Health Monitoring Method for Load Assessment and Cooling Performance Degradation of Printed Circuit Boards
Topics: Cooling, Printed circuit boards, Stress, Temperature, Computer-aided engineering, Deformation, Electronic equipment, Reliability, Design, Design methodology