Abstract
With the increasing power requirements of electronic devices, high heat flux will cause serious damage to the devices. Based on the basic theory of micro-nano heat transfer, the series and topological microchannel heat sink models are established. The flow field characteristics and temperature distribution in the heat sink are analyzed by numerical calculation. The effects of channel structure on temperature, pressure drop, the Nusselt number, and enhanced heat transfer factor are compared, and the micro-mechanism of heat transfer enhancement in microchannels is clarified. It is found that the Nusselt number of the flow field can be significantly increased by adding the triangular groove in the microchannel, and the enhanced heat transfer factor in the channel can be greatly improved by the topological structure. Further analysis of the factors such as angle α, diameter ratios γ, and topological structures of the triangular groove shows that when α = 70 deg, the Nusselt number of the flow field is 3.1 times of that of the straight channel and the enhanced heat transfer factor is 2.7 times of that of it; compared with the straight channel, the comprehensive heat transfer performance of the microchannel with γ = 1/2 is improved by 31%; when using variable cross-sectional topology microchannel with triangle structure (T.Tr.N.) topology, the convective heat transfer of the microchannel is 2.6 times of that of the straight channel and the comprehensive heat transfer performance is increased by 5.9 times.
