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Keywords: semiconductor device packaging
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. December 2009, 1(4): 041009.
Published Online: June 24, 2010
...://www.lacotech.com/products/997300658_leaktechref.pdf . 12 11 2009 21 04 2010 24 06 2010 24 06 2010 bonding processes cooling hermetic seals photolithography power semiconductor devices semiconductor device packaging thermal management (packaging) wick structure heat...