Ultrasonic waves at 1 MHz are used to send information across solid walls without the needs for through wall penetrations. A communication channel is established by attaching a set of three ultrasonic transducers to the wall. The first transducer transmits a continuous ultrasonic wave into the wall. The second transducer is mounted on the opposite side of the wall (inside) and operates as a receiver and signal modulator. The third transducer, the outside receiving transducer, is installed on the same side as the first transducer where it is exposed to the signal reflected from the blended interface of the inside wall and inside transducer. Inside sensor data is digitized and the bit state is used to vary in time the electrical load connected to the inside transducer, changing its acoustic impedance in accordance with each data bit. These impedance changes modulate the amplitude of the reflected ultrasonic signal. The modulated signal is detected at the outside receiving transducer, where it is then demodulated to recover the data. Additionally, some of the ultrasonic power received at the inside transducer is harvested to provide energy for the communication and sensor system on the inside. The entire system (ultrasonic, solid wall, and electronic) is modeled in the electrical domain by means of electro-mechanical analogies. This approach enables the concurrent simulation of the ultrasonic and electronic components. A model of the communication system is implemented in an electronic circuit simulation package, which assisted in the analysis and optimization of the communication channel. Good agreement was found between the modeled and experimental results.
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February 2013
Research-Article
An Ultrasonic Through-Wall Communication (UTWC) System Model
Sebastian Roa-Prada,
Sebastian Roa-Prada
1
Mem. ASME
Department of Mechatronics Engineering,
Avenida 42 No. 48-11,
Bucaramanga, Santander, Colombia
e-mail: sroa@unab.edu.co
Department of Mechatronics Engineering,
Universidad Autónoma de Bucaramanga
,Avenida 42 No. 48-11,
Bucaramanga, Santander, Colombia
e-mail: sroa@unab.edu.co
1Corresponding author.
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Henry A. Scarton,
Henry A. Scarton
Life Fellow ASME
Department of Mechanical,
Aerospace & Nuclear Engineering,
Rensselaer Polytechnic Institute,
Troy, NY 12180
e-mail: scarton@rpi.edu
Department of Mechanical,
Aerospace & Nuclear Engineering,
Rensselaer Polytechnic Institute,
Troy, NY 12180
e-mail: scarton@rpi.edu
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David A. Shoudy,
Jonathan D. Ashdown,
Jonathan D. Ashdown
e-mail: ashdoj@rpi.edu
Department of Electrical
,Computer & Systems Engineering
,Rensselaer Polytechnic Institute Troy
,NY 12180
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Pankaj K. Das,
Pankaj K. Das
Electrical and Computer Engineering,
e-mail: das@ece.ucsd.edu
University of California
,La Jolla, CA 92093-0407
e-mail: das@ece.ucsd.edu
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Andrew J. Gavens
e-mail: andrew.gavens.contractor@unnpp.gov
Andrew J. Gavens
Bechtel Marine Propulsion Corporation
,Schenectady, NY 12309
e-mail: andrew.gavens.contractor@unnpp.gov
Search for other works by this author on:
Sebastian Roa-Prada
Mem. ASME
Department of Mechatronics Engineering,
Avenida 42 No. 48-11,
Bucaramanga, Santander, Colombia
e-mail: sroa@unab.edu.co
Department of Mechatronics Engineering,
Universidad Autónoma de Bucaramanga
,Avenida 42 No. 48-11,
Bucaramanga, Santander, Colombia
e-mail: sroa@unab.edu.co
Henry A. Scarton
Life Fellow ASME
Department of Mechanical,
Aerospace & Nuclear Engineering,
Rensselaer Polytechnic Institute,
Troy, NY 12180
e-mail: scarton@rpi.edu
Department of Mechanical,
Aerospace & Nuclear Engineering,
Rensselaer Polytechnic Institute,
Troy, NY 12180
e-mail: scarton@rpi.edu
Gary J. Saulnier
e-mail: saulng@rpi.edu
David A. Shoudy
e-mail: dshoudy@gmail.com
Jonathan D. Ashdown
e-mail: ashdoj@rpi.edu
Department of Electrical
,Computer & Systems Engineering
,Rensselaer Polytechnic Institute Troy
,NY 12180
Pankaj K. Das
Electrical and Computer Engineering,
e-mail: das@ece.ucsd.edu
University of California
,La Jolla, CA 92093-0407
e-mail: das@ece.ucsd.edu
Andrew J. Gavens
Bechtel Marine Propulsion Corporation
,Schenectady, NY 12309
e-mail: andrew.gavens.contractor@unnpp.gov
1Corresponding author.
Contributed by the Noise Control and Acoustics Division of ASME for publication in the Journal of Vibration and Acoustics. Manuscript received May 2, 2011; final manuscript received July 5, 2012; published online February 4, 2013. Assoc. Editor: Lonny Thompson.
J. Vib. Acoust. Feb 2013, 135(1): 011004 (12 pages)
Published Online: February 4, 2013
Article history
Received:
May 2, 2011
Revision Received:
July 5, 2012
Citation
Roa-Prada, S., Scarton, H. A., Saulnier, G. J., Shoudy, D. A., Ashdown, J. D., Das, P. K., and Gavens, A. J. (February 4, 2013). "An Ultrasonic Through-Wall Communication (UTWC) System Model." ASME. J. Vib. Acoust. February 2013; 135(1): 011004. https://doi.org/10.1115/1.4007565
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